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Special Issue "Advanced CMOS Image Sensors and Emerging Applications"

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: 28 February 2019

Special Issue Editor

Guest Editor
Prof. Dr. Keiichiro Kagawa

Research Institute of Electronics, Shizuoka University, Japan
Website | E-Mail
Interests: biomedical, industrial, and agricultural applications of high-performance and functional CMOS image sensors; computational cameras

Special Issue Information

Dear Colleagues,

It is my pleasure to invite you to submit your technological contributions to this Special Issue, titled “Advanced CMOS Image Sensors and Emerging Applications”.

The progress in image sensor technologies and applications of image sensors is tremendous. The continuous progress and diversity in the engineering of image sensors and imaging systems, as well as state-of-the-art and emerging technologies for/in image sensors will be explored.

CMOS image sensors are now used in various fields such as computational photography, augmented reality, digital healthcare, biomedical imaging, and so on. These applications require CMOS image sensors to have new functions or new architecture to enhance their performance. On the other hand, new fabrication technologies like plasmonics will provide new features to sensor pixels.

This Special Issue aims to highlight advances in functional and high-performance CMOS image sensors. In addition, useful suggestions for image sensors from any technologies of image sensor applications, which can evolve or change the image sensor architecture, are also welcome. Topics include, but are not limited to:

  • Image sensor technologies: process, circuit, architecture
  • Image sensors for/in optics and photonics: nanophotonics, plasmonics, microscopy, spectroscopy
  • Image sensors for/in computational imaging and computational photography
  • Imaging systems with state-of-the-art image sensors
  • Image sensors for/in emerging applications and related topics of image sensors and imaging systems: Multi-spectral imaging, ultra-fast imaging, biomedical imaging, IoT, VR, deep learning, and so on

This Special Issue cooperate with the "4th International Workshop on Image Sensors and Imaging Systems (IWISS2018)", held in Tokyo, Japan, 28–29 November 2018. The authors of papers presented at this conference and within the scope of Sensors may submit a technically extended version to this Special Issue.

4th International Workshop on Image Sensors and Imaging Systems:
http://www.i-photonics.jp/meetings.html#20181128IWISS

Important Dates for IWISS2018:
October 5, 2018—Abstract Submission Deadline

Prof. Dr. Keiichiro Kagawa
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access bimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • CMOS image sensors
  • CMOS image sensor process
  • CMOS image sensor circuits
  • CMOS image sensor architecture
  • CMOS image sensor applications
  • Imaging systems

Published Papers (1 paper)

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Research

Open AccessArticle An Analog-Front ROIC with On-Chip Non-Uniformity Compensation for Diode-Based Infrared Image Sensors
Sensors 2019, 19(2), 298; https://doi.org/10.3390/s19020298
Received: 24 November 2018 / Revised: 8 January 2019 / Accepted: 10 January 2019 / Published: 13 January 2019
PDF Full-text (6663 KB)
Abstract
This paper proposes a CMOS front-end readout-integrated circuit (ROIC) with on-chip non-uniformity compensation technique for a diode-based uncooled infrared image sensor. Two techniques are adopted to achieve on-chip non-uniformity compensation: a reference dummy metal line is introduced to alleviate the dominant non-uniformity with
[...] Read more.
This paper proposes a CMOS front-end readout-integrated circuit (ROIC) with on-chip non-uniformity compensation technique for a diode-based uncooled infrared image sensor. Two techniques are adopted to achieve on-chip non-uniformity compensation: a reference dummy metal line is introduced to alleviate the dominant non-uniformity with IR-drop presented in large pixel array, and a current splitting architecture-based variable current source for diode bias is proposed to compensate other residual non-uniformity. A differential integrator is chosen as the main amplifier of readout circuit for its superior noise performance. For low power design, a pulse-powered row buffer is designed in this work. The proposed ROIC for 384 × 288 diode-based detector array is fabricated with a 0.35- μ m CMOS process. It occupies an area of 4.4 mm × 15 mm, and the power consumption is 180 mW. The measured result shows that with the proposed on-chip non-uniformity compensation, the output voltage variation is greatly reduced from 2.5 V to 60 mV. Full article
(This article belongs to the Special Issue Advanced CMOS Image Sensors and Emerging Applications)
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