Modelling, Simulation, Design, and Manufacturing of CMOS Integrated MEMS

Dear Colleagues,

For the last few decades, MEMS research and the MEMS market were often based on the “one product, one process” principle. Even if this approach seems to be the best for high-performance applications, it leads to high manufacturing costs due to the low volume of each specific process and high packaging costs due to the low compatibility of the MEMS process with integrated electronics that imposes multi-die systems. Thus, monolithic integration of micro and nanosystems in standard microelectronics technologies (CMOS, BiCMOS, SOI, FinFET, etc.) is a key issue for the development of new low-cost sensing applications, Internet-of-Things systems and multisensor systems. Moreover, the use of standard technologies, the development of high-level models, and the integration of MEMS design capabilities in EDA software should allow to obtain libraries of customizable MEMS IPs that could be used by microelectronics system engineers as microelectronic standard cells (processor, memory, amplifier, etc.) for rapid and efficient design of highly integrated systems.

Therefore, this Special Issue focuses on the modeling, simulation, design, and manufacture of CMOS-integrated MEMS sensors, but MEMS integrated in other standard microelectronics technologies will be also considered. Original research and review papers are welcome. Topics include but are not limited to:

• Modeling, simulation, and integration of new physical, chemical or biological MEMS sensors in standard microelectronics technologies;
• Technological add-ons to standard microelectronics technologies for MEMS integration;
• Electronic design automation for MEMS design, co-simulation of MEMS with electronics, high-level modeling of MEMS;
• Integrated self-test and self-calibration of MEMS, industrial test procedures of CMOS MEMS.

Dr. Frédérick Mailly
Prof. Dr. Pascal Nouet
Guest Editors

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