Polymer Composites for Electrical and Electronic Engineering Applications, 2nd Edition

Dear Colleagues,

We cordially invite you to submit your research papers, communications, or review articles to the Special Issue entitled “Polymer Composites for Electrical and Electronic Engineering Applications.”

Polymer composite materials have attracted great interest for the development of electrical and electronic engineering and technology and have been widely applied in electrical power systems, electrical insulation equipment, electrical and electronic devices, etc. Due to the significant expansion in the use of newly developed polymer composite materials, it is necessary to understand and accurately describe the relationship between composite structure and material properties. It is possible to estimate the properties for their future commercial applications solely via thorough laboratory characterization.

This Special Issue focuses on polymer composites applied in the field of electrical and electronic equipment, including (but not limited to) the synthesis and preparation of new polymeric materials, the structure–property relationship of polymer composites, the evaluation of material application, simulation, and modeling of material performance.

We look forward to receiving your outstanding work for this Special Issue.

Dr. Shaojian He
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• polymer composite
• electrical insulation
• electronic materials
• electromagnetic shielding
• dielectric properties
• mechanical properties
• heat dissipation
• breakdown
• aging