Advances in Semiconductor Photonic Integrated Circuits
A special issue of Photonics (ISSN 2304-6732).
Deadline for manuscript submissions: 31 March 2025 | Viewed by 875
Special Issue Editors
Interests: narrow linewidth semiconductor laser; passive mode-locked semiconductor laser; integrated direct-modulated semiconductor laser; monolithic integration and its fabrication technique; photonic integrated circuits devices and its application in communication and sensing
Interests: photonic integrated circuits; silicon photonics; heterogeneous integration; integrated lasers; high speed modulators; high speed photodetectors; monolithic integration; optical communication; semiconductor devices
Special Issue Information
Dear Colleagues,
The field of semiconductor photonic integrated circuits (PICs) has seen remarkable progress over the past few decades, significantly impacting various technological domains such as telecommunications, data centers, sensing, and quantum computing. Semiconductor PICs integrate multiple photonic functions on a single chip, leading to enhanced performance, reduced costs, and minimized energy consumption. Innovations in materials, fabrication technologies, and design methodologies continue to drive the evolution of this field. Moreover, the convergence of electronics and photonics on a common platform has opened new possibilities for creating highly efficient and compact devices that outperform their traditional counterparts. With advancements in all of these integration technologies, such as monolithic integration, heterogeneous integration, and new material platforms, the potential applications of PICs are expanding rapidly, from high-speed data transmission to precise biomedical sensing and beyond.
This Special Issue focuses on the latest advancements in semiconductor photonic integrated circuits. In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following:
- Novel semiconductor materials and devices for photonic integration;
- Advanced fabrication technologies;
- High-speed, high-density and low-consumption PICs;
- Integrated lasers, modulators, photodetectors and others;
- Photonic–electronic integration;
- PIC applications in telecommunications and data centers, sensing and imaging technologies, quantum photonics and quantum computing, etc.;
- Thermal management in PICs;
- Reliability and packaging of PICs.
We look forward to receiving your contributions.
Prof. Dr. Ruiying Zhang
Prof. Dr. Hua Yang
Guest Editors
Manuscript Submission Information
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Keywords
- photonic integrated circuits
- semiconductor photonics
- integrated lasers, modulators, detectors
- integrated optical system on a chip
- integration methodology and technologies
- thermal management in PIC
- photonic–electronic integration
- reliability and packaging of PICs
- PIC application in communications, sensing, computing, imaging, AI, quantum photonics, and display
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