Open AccessArticle
Low-Loss, Multi-Reticle-Stitched SiN Waveguides for 300 mm Wafer-Level Optical Interconnects
by
Pengfei Xu, Chiara Marchese, Guy Lepage, Negin Golshani, Ruben Van Eenaeme, Andrea Mingardi, Joost Van Ongeval, Rafal Magdziak, Luc Halipre, Darko Trivkovic, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Filippo Ferraro, Yoojin Ban and Joris Van Campenhout
Viewed by 157
Abstract
With the rapid development of artificial intelligence (AI) and machine learning (ML) applications, wafer-level optical I/O is becoming increasingly attractive for massive and efficient data interconnects in future wafer-scale multi-processor-units (multi-XPU) compute clusters with unparalleled data bandwidth, energy efficiency, and low latency. In
[...] Read more.
With the rapid development of artificial intelligence (AI) and machine learning (ML) applications, wafer-level optical I/O is becoming increasingly attractive for massive and efficient data interconnects in future wafer-scale multi-processor-units (multi-XPU) compute clusters with unparalleled data bandwidth, energy efficiency, and low latency. In this paper, we present a 300 mm sized wafer reticle-stitched low-pressure chemical vapor deposition (LPCVD) silicon nitride (SiN) waveguide technology and demonstrate a multi-reticle-stitched ~56 cm long waveguides across 20 reticles with propagation loss of 0.13~0.15 dB/cm at 1310 nm wavelength, and <0.001~0.002 dB SiN waveguide stitch loss, which is because of <5 nm high-precision reticle lithography offset. These advantageous features of low-loss reticle-stitched SiN waveguides have the potential to significantly enhance future optically interconnected wafer-scale multi-chip compute systems.
Full article
►▼
Show Figures