Microwave Photonics: Science and Applications

A special issue of Photonics (ISSN 2304-6732).

Deadline for manuscript submissions: 10 October 2025 | Viewed by 176

Special Issue Editors


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Guest Editor
Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China
Interests: microwave photonics; optoelectronic devices; Si photonic integration optoelectronic package technology

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Guest Editor
National Defense Key Laboratory of Antenna and Microwave Technology, 14th Research Institute of China Electronics Science and Technology Group Corporation, Nanjing 210039, China
Interests: application of microwave photonics in phased array radar; hybrid integration of optoelcetronics

Special Issue Information

Dear Colleagues,

Microwave photonics has attracted enhanced attention due to its high bandwidth, low loss, and immunity to electromagnetic interference. This interdisciplinary area combines the high-speed capabilities of photonics with the well-established technology of microwaves, leading to innovative solutions in telecommunications, radar, and wireless systems. Microwave photonic devices are the core functional components of microwave photonic systems, typically consisting of lasers, modulators, detectors, photonic filters and optoelectronic oscillators. In order reduce the size and power consumption of these systems, microwave photonic integration will become an important area of research.

This Special Issue, entitled “Microwave Photonics: Science and Applications”, welcomes the submission of theoretical, numerical, and experimental papers that address advances in the field. The scope of this Special Issue includes, but is not limited to, the following topics:

  • High-efficiency optoelectronic devices, such as semicoductor laser/modulator/PD, etc;
  • Semiconductor Optical Amplifiers (SOAs) with a high output power and low noise figure;
  • Optoelectronic oscillator (OEOs)
  • Microwave photonic links with a high dynamicrange and low noise figure;
  • Silicon-based integrated photonic chips or devices;
  • Advanced photonic integration packaging technology;
  • Modeling and analysis of microwave photonic devices and links

Dr. Zhike Zhang
Dr. Hui Gao
Guest Editors

Manuscript Submission Information

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Keywords

  • microwave photonics
  • optoelectronic devices
  • photonic integration optoelectronic package

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Published Papers (1 paper)

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Research

15 pages, 8047 KiB  
Article
Compact Four-Channel Optical Emission Module with High Gain
by Xiying Dang, Linyi Li, Man Chen, Zijian Hu, Tianyu Yang, Zeping Zhao and Zhike Zhang
Photonics 2025, 12(5), 425; https://doi.org/10.3390/photonics12050425 - 28 Apr 2025
Viewed by 8
Abstract
In this paper, a four-channel optical emission module is developed using hybrid integration technology that integrates directly modulated laser (DML) chips, low-noise amplifier (LNA) chips, and control circuits, with dimensions of 24.4 mm × 21 mm × 5.9 mm. This module enables high-gain [...] Read more.
In this paper, a four-channel optical emission module is developed using hybrid integration technology that integrates directly modulated laser (DML) chips, low-noise amplifier (LNA) chips, and control circuits, with dimensions of 24.4 mm × 21 mm × 5.9 mm. This module enables high-gain signal output and minimizes crosstalk between neighboring channels while improving integration. An equivalent circuit model of radio frequency (RF) signal transmission is established, and the accuracy of the model and the effectiveness of the approach to improve signal gain are verified using simulations and experiments. With optimized thermal management, the module has the ability to operate at stable temperatures across an ambient range of −55 °C to 75 °C. The module has a channel wavelength spacing of approximately 1 nm, and the −3 dB bandwidth of each channel exceeds 20 GHz. The crosstalk between neighboring channels is less than −65 dB. In the range of 0.8~25 GHz, the four-channel gain is approximately 15 dB through the integration of the LNA chip. The module achieves a noise figure (NF) of less than 30 dB. Full article
(This article belongs to the Special Issue Microwave Photonics: Science and Applications)
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