Advances in Photonic–Electronic Integration

A special issue of Photonics (ISSN 2304-6732).

Deadline for manuscript submissions: 31 December 2025 | Viewed by 71

Special Issue Editors


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Guest Editor
College of Optoelectronic Engineering, Chongqing University, Chongqing 400044, China
Interests: integrated photonics; optoelectronics; photonic devices; fiber laser; optical fiber sensing; optical fiber communications

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Guest Editor
Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China
Interests: integrated photonics; optical fiber communications; silicon photonics; photonic–electronic integration

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Guest Editor
Associate Professor, Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117583, Singapore
Interests: integrated photonics; photonic devices; lithium niobate photonics; ising machine; barium titanate photonics

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Guest Editor
College of Optoelectronic Engineering, Chongqing University, Chongqing 400044, China
Interests: integrated photonics; silicon photonics; lithium niobate photonics; photonic integrated circuits; photonic–electronic integration

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Guest Editor
College of Optoelectronic Engineering, Chongqing University, Chongqing 400044, China
Interests: oxide electronics; magnetism and spintronics; surface and interface; non-volatile memory devices; semiconductor process integration; photonic materials and devices; integrated optoelectronics

Special Issue Information

Dear Colleagues,

Photonic–electronic integration is at the forefront of modern optoelectronic research, driving advancements in communication, computing, sensing, and novel device applications. By seamlessly combining photonic and electronic functionalities, this multidisciplinary field enables high-speed, large-capacity, energy-efficient, and compact systems that are essential for next-generation information processing and transmission. The continuous progress in integrated photonics and electronics opens new possibilities for high-performance computing, intelligent sensing, and high-speed and large-capacity data, shaping the future of technology.

This Special Issue on “Advances in Photonic–Electronic Integration” welcomes original research and review articles covering fundamental, methodological, and applied advancements, including but not limited to the following:

  • High-speed and large-capacity photonic–electronic integrated chip, including silicon photonic devices, thin-film lithium niobate/lithium titanate/barium titanate oxide devices, heterogeneous integration, etc.
  • Photonic–electronic integrated communication technologies for high-speed and low-power optical communication and quantum communication;
  • Photonic–electronic integrated computing technologies, including optical and quantum computing and neuromorphic architectures;
  • Photonic–electronic integrated sensing technologies for precise real-time environmental and biomedical applications;
  • Novel optoelectronic devices, systems, and applications, driving innovation across multiple domains.

We invite contributions that address theoretical modeling, device fabrication, system integration, performance optimization, and real-world applications of photonic–electronic integration. Studies focusing on experimental demonstrations, novel material platforms, and emerging trends in this field are particularly encouraged.

We look forward to your high-quality submissions and showcasing the latest breakthroughs in this exciting and rapidly evolving research area.

Prof. Dr. Tao Zhu
Prof. Dr. Yu Yu
Dr. Aaron Danner
Prof. Dr. Guanyu Chen
Dr. Yuanmin Du
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • photonic–electronic integration
  • silicon photonics/thin-film lithium niobate/lithium titanate/barium titanate oxide photonics
  • heterogeneous integration
  • optical computing
  • fiber-optic communication
  • integrated quantum devices
  • integrated optical sensing devices
  • optoelectronic devices and systems

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Published Papers

This special issue is now open for submission.
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