Editorial

2 pages, 184 KiB

Open AccessEditorial

Editorial for the Special Issue on Nanofabrication with Focused Electron/Ion Beam Induced Processing

by Rosa Córdoba

Micromachines 2021, 12(8), 893; https://doi.org/10.3390/mi12080893 - 28 Jul 2021

Cited by 2 | Viewed by 1171

Focused electron beam (FEB) and focused ion beam (FIB) technologies have opened novel paths for material science research and technology at the micro and nano scales in recent decades [...] Full article

(This article belongs to the Special Issue Nanofabrication with Focused Electron/Ion Beam Induced Processing)

Research

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14 pages, 4815 KiB

Open AccessArticle

Room Temperature Direct Electron Beam Lithography in a Condensed Copper Carboxylate

by Luisa Berger, Jakub Jurczyk, Katarzyna Madajska, Iwona B. Szymańska, Patrik Hoffmann and Ivo Utke

Micromachines 2021, 12(5), 580; https://doi.org/10.3390/mi12050580 - 20 May 2021

Cited by 7 | Viewed by 3340

Abstract

High-resolution metallic nanostructures can be fabricated with multistep processes, such as electron beam lithography or ice lithography. The gas-assisted direct-write technique known as focused electron beam induced deposition (FEBID) is more versatile than the other candidates. However, it suffers from low throughput. This [...] Read more.

High-resolution metallic nanostructures can be fabricated with multistep processes, such as electron beam lithography or ice lithography. The gas-assisted direct-write technique known as focused electron beam induced deposition (FEBID) is more versatile than the other candidates. However, it suffers from low throughput. This work presents the combined approach of FEBID and the above-mentioned lithography techniques: direct electron beam lithography (D-EBL). A low-volatility copper precursor is locally condensed onto a room temperature substrate and acts as a positive tone resist. A focused electron beam then directly irradiates the desired patterns, leading to local molecule dissociation. By rinsing or sublimation, the non-irradiated precursor is removed, leaving copper-containing structures. Deposits were formed with drastically enhanced growth rates than FEBID, and their composition was found to be comparable to gas-assisted FEBID structures. The influence of electron scattering within the substrate as well as implementing a post-purification protocol were studied. The latter led to the agglomeration of high-purity copper crystals. We present this as a new approach to electron beam-induced fabrication of metallic nanostructures without the need for cryogenic or hot substrates. D-EBL promises fast and easy fabrication results. Full article

(This article belongs to the Special Issue Nanofabrication with Focused Electron/Ion Beam Induced Processing)

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12 pages, 16904 KiB

Open AccessArticle

Branched High Aspect Ratio Nanostructures Fabricated by Focused Helium Ion Beam Induced Deposition of an Insulator

by Frances I. Allen

Micromachines 2021, 12(3), 232; https://doi.org/10.3390/mi12030232 - 25 Feb 2021

Cited by 7 | Viewed by 1679

Abstract

Helium ion beam induced deposition using the gaseous precursor pentamethylcyclopentasiloxane is employed to fabricate high aspect ratio insulator nanostructures (nanopillars and nanocylinders) that exhibit charge induced branching. The branched nanostructures are analyzed by transmission electron microscopy. It is found that the side branches [...] Read more.

Helium ion beam induced deposition using the gaseous precursor pentamethylcyclopentasiloxane is employed to fabricate high aspect ratio insulator nanostructures (nanopillars and nanocylinders) that exhibit charge induced branching. The branched nanostructures are analyzed by transmission electron microscopy. It is found that the side branches form above a certain threshold height and that by increasing the flow rate of the precursor, the vertical growth rate and branching phenomenon can be significantly enhanced, with fractalesque branching patterns observed. The direct-write ion beam nanofabrication technique described herein offers a fast single-step method for the growth of high aspect ratio branched nanostructures with site-selective placement on the nanometer scale. Full article

(This article belongs to the Special Issue Nanofabrication with Focused Electron/Ion Beam Induced Processing)

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13 pages, 4201 KiB

Open AccessFeature PaperEditor’s ChoiceArticle

Expanding 3D Nanoprinting Performance by Blurring the Electron Beam

by Lukas Matthias Seewald, Robert Winkler, Gerald Kothleitner and Harald Plank

Micromachines 2021, 12(2), 115; https://doi.org/10.3390/mi12020115 - 22 Jan 2021

Cited by 7 | Viewed by 2690

Abstract

Additive, direct-write manufacturing via a focused electron beam has evolved into a reliable 3D nanoprinting technology in recent years. Aside from low demands on substrate materials and surface morphologies, this technology allows the fabrication of freestanding, 3D architectures with feature sizes down to [...] Read more.

Additive, direct-write manufacturing via a focused electron beam has evolved into a reliable 3D nanoprinting technology in recent years. Aside from low demands on substrate materials and surface morphologies, this technology allows the fabrication of freestanding, 3D architectures with feature sizes down to the sub-20 nm range. While indispensably needed for some concepts (e.g., 3D nano-plasmonics), the final applications can also be limited due to low mechanical rigidity, and thermal- or electric conductivities. To optimize these properties, without changing the overall 3D architecture, a controlled method for tuning individual branch diameters is desirable. Following this motivation, here, we introduce on-purpose beam blurring for controlled upward scaling and study the behavior at different inclination angles. The study reveals a massive boost in growth efficiencies up to a factor of five and the strong delay of unwanted proximal growth. In doing so, this work expands the design flexibility of this technology. Full article

(This article belongs to the Special Issue Nanofabrication with Focused Electron/Ion Beam Induced Processing)

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10 pages, 2525 KiB

Open AccessArticle

Combined Focused Electron Beam-Induced Deposition and Etching for the Patterning of Dense Lines without Interconnecting Material

by Sangeetha Hari, P. H. F. Trompenaars, J. J. L. Mulders, Pieter Kruit and C. W. Hagen

Micromachines 2021, 12(1), 8; https://doi.org/10.3390/mi12010008 - 24 Dec 2020

Cited by 3 | Viewed by 1734

Abstract

High resolution dense lines patterned by focused electron beam-induced deposition (FEBID) have been demonstrated to be promising for lithography. One of the challenges is the presence of interconnecting material, which is often carbonaceous, between the lines as a result of the Gaussian line [...] Read more.

High resolution dense lines patterned by focused electron beam-induced deposition (FEBID) have been demonstrated to be promising for lithography. One of the challenges is the presence of interconnecting material, which is often carbonaceous, between the lines as a result of the Gaussian line profile. We demonstrate the use of focused electron beam-induced etching (FEBIE) as a scanning electron microscope (SEM)-based direct-write technique for the removal of this interconnecting material, which can be implemented without removing the sample from the SEM for post processing. Secondary electron (SE) imaging has been used to monitor the FEBIE process, and atomic force microscopy (AFM) measurements confirm the fabrication of well separated FEBID lines. We further demonstrate the application of this technique for removing interconnecting material in high resolution dense lines using backscattered electron (BSE) imaging to monitor the process. Full article

(This article belongs to the Special Issue Nanofabrication with Focused Electron/Ion Beam Induced Processing)

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17 pages, 3579 KiB

Open AccessArticle

Combined Ammonia and Electron Processing of a Carbon-Rich Ruthenium Nanomaterial Fabricated by Electron-Induced Deposition

by Markus Rohdenburg, Johannes E. Fröch, Petra Martinović, Charlene J. Lobo and Petra Swiderek

Micromachines 2020, 11(8), 769; https://doi.org/10.3390/mi11080769 - 12 Aug 2020

Cited by 5 | Viewed by 3022

Abstract

Ammonia (NH₃)-assisted purification of deposits fabricated by focused electron beam-induced deposition (FEBID) has recently been proven successful for the removal of halide contaminations. Herein, we demonstrate the impact of combined NH₃ and electron processing on FEBID deposits containing hydrocarbon contaminations [...] Read more.

Ammonia (NH₃)-assisted purification of deposits fabricated by focused electron beam-induced deposition (FEBID) has recently been proven successful for the removal of halide contaminations. Herein, we demonstrate the impact of combined NH₃ and electron processing on FEBID deposits containing hydrocarbon contaminations that stem from anionic cyclopentadienyl-type ligands. For this purpose, we performed FEBID using bis(ethylcyclopentadienyl)ruthenium(II) as the precursor and subjected the resulting deposits to NH₃ and electron processing, both in an environmental scanning electron microscope (ESEM) and in a surface science study under ultrahigh vacuum (UHV) conditions. The results provide evidence that nitrogen from NH₃ is incorporated into the carbon content of the deposits which results in a covalent nitride material. This approach opens a perspective to combine the promising properties of carbon nitrides with respect to photocatalysis or nanosensing with the unique 3D nanoprinting capabilities of FEBID, enabling access to a novel class of tailored nanodevices. Full article

(This article belongs to the Special Issue Nanofabrication with Focused Electron/Ion Beam Induced Processing)

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12 pages, 3622 KiB

Open AccessArticle

The Relationships of Microscopic Evolution to Resistivity Variation of a FIB-Deposited Platinum Interconnector

by Chaorong Zhong, Ruijuan Qi, Yonghui Zheng, Yan Cheng, Wenxiong Song and Rong Huang

Micromachines 2020, 11(6), 588; https://doi.org/10.3390/mi11060588 - 12 Jun 2020

Cited by 3 | Viewed by 2596

Abstract

Depositing platinum (Pt) interconnectors during the sample preparation process via a focused ion beam (FIB) system is an inescapable procedure for in situ transmission electron microscopy (TEM) investigations. To achieve good electrical contact and avoid irreversible damage in practical samples, the microscopic evolution [...] Read more.

Depositing platinum (Pt) interconnectors during the sample preparation process via a focused ion beam (FIB) system is an inescapable procedure for in situ transmission electron microscopy (TEM) investigations. To achieve good electrical contact and avoid irreversible damage in practical samples, the microscopic evolution mechanism of FIB-deposited Pt interconnectors need a more comprehensive understanding, though it is known that its resistivity could be affected by thermal annealing. In this work, an electron-beam FIB-deposited Pt interconnector was studied by advanced spherical aberration (Cs)-corrected TEM combined with an in situ heating and biasing system to clarify the relationship of microscopic evolution to resistivity variation. During the heating process, the Pt interconnector underwent crystallization, organic matter decomposition, Pt nanocrystal growth, grain connection, and conductive path formation, which are combined actions to cause several orders of magnitude of resistivity reduction. The comprehensive understanding of the microscopic evolution of FIB-deposited Pt material is beneficial, not only for optimizing the resistance performance of Pt as an interconnector, but also for understanding the role of C impurities with metal materials. For the purpose of wiring, annealed electron-beam (EB)-deposited Pt material can be recommended for use as an interconnector in devices for research purposes. Full article

(This article belongs to the Special Issue Nanofabrication with Focused Electron/Ion Beam Induced Processing)

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13 pages, 6290 KiB

Open AccessArticle

Direct Write of 3D Nanoscale Mesh Objects with Platinum Precursor via Focused Helium Ion Beam Induced Deposition

by Alex Belianinov, Matthew J. Burch, Anton Ievlev, Songkil Kim, Michael G. Stanford, Kyle Mahady, Brett B. Lewis, Jason D. Fowlkes, Philip D. Rack and Olga S. Ovchinnikova

Micromachines 2020, 11(5), 527; https://doi.org/10.3390/mi11050527 - 22 May 2020

Cited by 15 | Viewed by 3316

Abstract

The next generation optical, electronic, biological, and sensing devices as well as platforms will inevitably extend their architecture into the 3rd dimension to enhance functionality. In focused ion beam induced deposition (FIBID), a helium gas field ion source can be used with an [...] Read more.

The next generation optical, electronic, biological, and sensing devices as well as platforms will inevitably extend their architecture into the 3rd dimension to enhance functionality. In focused ion beam induced deposition (FIBID), a helium gas field ion source can be used with an organometallic precursor gas to fabricate nanoscale structures in 3D with high-precision and smaller critical dimensions than focused electron beam induced deposition (FEBID), traditional liquid metal source FIBID, or other additive manufacturing technology. In this work, we report the effect of beam current, dwell time, and pixel pitch on the resultant segment and angle growth for nanoscale 3D mesh objects. We note subtle beam heating effects, which impact the segment angle and the feature size. Additionally, we investigate the competition of material deposition and sputtering during the 3D FIBID process, with helium ion microscopy experiments and Monte Carlo simulations. Our results show complex 3D mesh structures measuring ~300 nm in the largest dimension, with individual features as small as 16 nm at full width half maximum (FWHM). These assemblies can be completed in minutes, with the underlying fabrication technology compatible with existing lithographic techniques, suggesting a higher-throughput pathway to integrating FIBID with established nanofabrication techniques. Full article

(This article belongs to the Special Issue Nanofabrication with Focused Electron/Ion Beam Induced Processing)

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Review

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28 pages, 4560 KiB

Open AccessReview

Focused Ion Beam Processing for 3D Chiral Photonics Nanostructures

by Mariachiara Manoccio, Marco Esposito, Adriana Passaseo, Massimo Cuscunà and Vittorianna Tasco

Micromachines 2021, 12(1), 6; https://doi.org/10.3390/mi12010006 - 23 Dec 2020

Cited by 30 | Viewed by 7830

Abstract

The focused ion beam (FIB) is a powerful piece of technology which has enabled scientific and technological advances in the realization and study of micro- and nano-systems in many research areas, such as nanotechnology, material science, and the microelectronic industry. Recently, its applications [...] Read more.

The focused ion beam (FIB) is a powerful piece of technology which has enabled scientific and technological advances in the realization and study of micro- and nano-systems in many research areas, such as nanotechnology, material science, and the microelectronic industry. Recently, its applications have been extended to the photonics field, owing to the possibility of developing systems with complex shapes, including 3D chiral shapes. Indeed, micro-/nano-structured elements with precise geometrical features at the nanoscale can be realized by FIB processing, with sizes that can be tailored in order to tune optical responses over a broad spectral region. In this review, we give an overview of recent efforts in this field which have involved FIB processing as a nanofabrication tool for photonics applications. In particular, we focus on FIB-induced deposition and FIB milling, employed to build 3D nanostructures and metasurfaces exhibiting intrinsic chirality. We describe the fabrication strategies present in the literature and the chiro-optical behavior of the developed structures. The achieved results pave the way for the creation of novel and advanced nanophotonic devices for many fields of application, ranging from polarization control to integration in photonic circuits to subwavelength imaging. Full article

(This article belongs to the Special Issue Nanofabrication with Focused Electron/Ion Beam Induced Processing)

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