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Micromachines
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Nanoscale Lithography—Pressing Miniaturization towards Ever Smaller Sizes
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Nanoscale Lithography—Pressing Miniaturization towards Ever Smaller Sizes

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".

Deadline for manuscript submissions: closed (31 December 2025) | Viewed by 21856

Special Issue Editor

Prof. Dr. Jayne C. Garno

E-Mail Website
Guest Editor
Chemistry Department, Louisiana State University, 232 Choppin Hall, Baton Rouge, LA 70803, USA
Interests: SPM; AFM; photocurrents; magnetic nanomaterials; surface science; self-assembled monolayers; nanolithography
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Innovative research has expanded the limits of nanofabrication to ever-smaller size scales, approaching the molecular level. Nanolithography encompasses the tools required to prepare surface structures with well-defined geometries and composition. Nanoscale lithography can be employed to control the arrangement of nanomaterials, biomolecules and organic films and offers unprecedented control for potential device applications, such as sensors, memory storage and molecular electronics. This Special Issue will showcase contributions that present advancements in nanolithography, such as approaches using scanning-probe-based lithography, photolithography, colloidal lithography or ion etching. Correspondingly, nanolithography can disclose detailed information at the smallest of size scales to facilitate studies of the chemistry and associated properties of materials. In addition, the size and composition of nanofabricated patterns can be used to tailor the optical, magnetic and electronic properties of materials for material design. We welcome the submission of short communications, research articles and reviews that describe protocols and studies performed using nanoscale lithography.

Prof. Dr. Jayne C. Garno
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • nanolithography
  • nanopatterning
  • Scanning Probe Microscopy (SPM)
  • nanoscience
  • nanomaterials, organic films and polymers
  • nanofabrication

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Related Special Issue

Published Papers (4 papers)

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Research

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13 pages, 2369 KB  
Article
Smooth Critical Dimension Compensation Across Photomask Transmittance Discontinuities Enabled by Selective and Direct Laser Patterning Inside Mask
by Dabin Park, Geumsu Yeom, Sungho Jeong and Junsu Park
Micromachines 2026, 17(1), 95; https://doi.org/10.3390/mi17010095 - 11 Jan 2026
Viewed by 534
Abstract
A selective laser patterning technique applied inside photomasks as a practical method to mitigate critical-dimension non-uniformity caused by overexposure in large-area lithography systems with segmented illumination was investigated. The geometric characteristics of laser-induced voids were analyzed depending on various laser patterning conditions, and [...] Read more.
A selective laser patterning technique applied inside photomasks as a practical method to mitigate critical-dimension non-uniformity caused by overexposure in large-area lithography systems with segmented illumination was investigated. The geometric characteristics of laser-induced voids were analyzed depending on various laser patterning conditions, and the resulting critical-dimension behavior was evaluated across regions with various transmittance levels, including sharply discontinuous transmittance boundaries. The results show that the void size and morphology can be tuned by adjusting the laser pulse energy, although excessive pulse energy leads to mask fracture, from which we derived appropriate processing windows. Furthermore, photomask transmittance was controllable over a wide range (20–92%) by varying laser parameters, void density, pattern arrangement, and the number of patterned layers. This enabled critical-dimension compensation with nanometer- to tens-of-nanometer-level precision. To examine critical-dimension behavior under abrupt transmittance transitions analogous to overexposure zones, 80% and 50% transmittance regions were placed adjacently. Despite the 30% transmittance difference, critical-dimension variation remained smooth, confirming that sharp transmittance changes do not induce abrupt critical-dimension shifts. Overall, our findings experimentally demonstrate that selective and direct laser patterning inside photomasks is a practical and effective critical-dimension compensation approach for large-area lithography employing segmented illumination systems. Full article
(This article belongs to the Special Issue Nanoscale Lithography—Pressing Miniaturization towards Ever Smaller Sizes)
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11 pages, 1811 KB  
Article
In Situ Dynamic Spectroscopic Ellipsometry Characterization of Cu-Ligated Mercaptoalkanoic Acid “Molecular” Ruler Multilayers
by Alexandra M. Patron, Kayleigh L. Coleman and Thomas J. Mullen
Micromachines 2024, 15(7), 826; https://doi.org/10.3390/mi15070826 - 26 Jun 2024
Viewed by 1859
Abstract
Hybrid strategies that combine conventional top-down lithography with bottom-up molecular assembly are of interest for a range of applications including nanolithography and sensors. Interest in these strategies stems from the ability to create complex architectures over large areas with molecular-scale control and precision. [...] Read more.
Hybrid strategies that combine conventional top-down lithography with bottom-up molecular assembly are of interest for a range of applications including nanolithography and sensors. Interest in these strategies stems from the ability to create complex architectures over large areas with molecular-scale control and precision. The molecular-ruler process typifies this approach where the sequential layer-by-layer assembly of mercaptoalkanoic acid molecules and metal ions are combined with conventional top-down lithography to create precise, registered nanogaps. However, the quality of the metal-ligated mercaptoalkanoic acid multilayer is a critical characteristic in generating reproducible and robust nanoscale structures via the molecular-ruler process. Therefore, we explore the assembly of alkanethiolate monolayers, mercaptohexadecanoic acid (MHDA) monolayers, and Cu-ligated MHDA multilayers on Au{111} substrates using atomic force microscopy and in situ dynamic spectroscopic ellipsometry. The chemical film thicknesses in situ dynamic spectroscopic ellipsometry agree with previous ex situ surface analytical methods. Moreover, in situ dynamic spectroscopic ellipsometry provides insight into the assembly process without interrupting the assembly process and potentially altering the characteristics of the resulting chemical film. By following the real-time dynamics of each deposition step, the assembly of the Cu-ligated MHDA multilayers can be optimized to minimize deposition time while having minimal impact to the quality of the chemical film. Full article
(This article belongs to the Special Issue Nanoscale Lithography—Pressing Miniaturization towards Ever Smaller Sizes)
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Review

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38 pages, 7875 KB  
Review
The Evolution of Lithography: From Resolution Scaling to Manufacturing Constraints
by Heejoon Chae, Hyunje Park and Dae Joon Kang
Micromachines 2026, 17(2), 261; https://doi.org/10.3390/mi17020261 - 18 Feb 2026
Viewed by 1803
Abstract
Lithographic patterning continues to evolve under the dual pressure of ever-finer features and manufacturable, cost-effective integration. Beyond headline resolution, industrial adoption is increasingly determined by a small set of coupled metrics: throughput, overlay (registration), defectivity, and cost, as well as by how these [...] Read more.
Lithographic patterning continues to evolve under the dual pressure of ever-finer features and manufacturable, cost-effective integration. Beyond headline resolution, industrial adoption is increasingly determined by a small set of coupled metrics: throughput, overlay (registration), defectivity, and cost, as well as by how these trade-offs shift with materials, substrate form factors, and integration flows. Here, we review lithographic techniques across three eras: traditional methods (pre-1990s), non-conventional innovations (1990s), and contemporary advancements (post-2000s), with an explicit goal that goes beyond compilation. Specifically, we provide a decision framework for interpreting each method using the same manufacturing-relevant criteria. For each class of technique, we summarize the operating principle and representative process routes, then map the dominant bottlenecks to the metric that ultimately limits scale-up. This cross-cutting lens clarifies why many emerging methods are compelling at the physics level yet remain constrained at the system level, where process windows, in-line control, and compatibility with existing fabrication ecosystems govern viability. By connecting mechanism-level innovation to manufacturing-level constraints, this review offers practical guidance for researchers and engineers seeking to position nanolithography options for applications ranging from high-volume semiconductor production to agile prototyping and materials- or substrate-limited devices. Full article
(This article belongs to the Special Issue Nanoscale Lithography—Pressing Miniaturization towards Ever Smaller Sizes)
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34 pages, 4857 KB  
Review
Grayscale Lithography and a Brief Introduction to Other Widely Used Lithographic Methods: A State-of-the-Art Review
by Svetlana N. Khonina, Nikolay L. Kazanskiy and Muhammad A. Butt
Micromachines 2024, 15(11), 1321; https://doi.org/10.3390/mi15111321 - 30 Oct 2024
Cited by 57 | Viewed by 16823
Abstract
Lithography serves as a fundamental process in the realms of microfabrication and nanotechnology, facilitating the transfer of intricate patterns onto a substrate, typically in the form of a wafer or a flat surface. Grayscale lithography (GSL) is highly valued in precision manufacturing and [...] Read more.
Lithography serves as a fundamental process in the realms of microfabrication and nanotechnology, facilitating the transfer of intricate patterns onto a substrate, typically in the form of a wafer or a flat surface. Grayscale lithography (GSL) is highly valued in precision manufacturing and research endeavors because of its unique capacity to create intricate and customizable patterns with varying depths and intensities. Unlike traditional binary lithography, which produces discrete on/off features, GSL offers a spectrum of exposure levels. This enables the production of complex microstructures, diffractive optical elements, 3D micro-optics, and other nanoscale designs with smooth gradients and intricate surface profiles. GSL plays a crucial role in sectors such as microelectronics, micro-optics, MEMS/NEMS manufacturing, and photonics, where precise control over feature depth, shape, and intensity is critical for achieving advanced functionality. Its versatility and capacity to generate tailored structures make GSL an indispensable tool in various cutting-edge applications. This review will delve into several lithographic techniques, with a particular emphasis on masked and maskless GSL methods. As these technologies continue to evolve, the future of 3D micro- and nanostructure manufacturing will undoubtedly assume even greater significance in various applications. Full article
(This article belongs to the Special Issue Nanoscale Lithography—Pressing Miniaturization towards Ever Smaller Sizes)
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