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Micromachines
Special Issues
Novel Processes for Cutting, Grinding and Polishing of Microstructured Surfaces
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Novel Processes for Cutting, Grinding and Polishing of Microstructured Surfaces

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 30 March 2026 | Viewed by 2655

Special Issue Editors

Dr. Jiang Guo

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Guest Editor
School of Mechanical Engineering, Dalian University of Technology, Dalian 116024, China
Interests: intelligent precision machining; surface integrity; precision measurement
Special Issues, Collections and Topics in MDPI journals
Dr. Yanjun Lu

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Guest Editor
Guangdong Provincial Key Laboratory of Micro/Nano Optomechatronics Engineering, College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen 518060, China
Interests: precision grinding; ultra-precision grinding; micro-nano structure machining
Dr. Zili Zhang

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Guest Editor
Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong 999077, China
Interests: fluid jet polishing; CFD simulation; structured surface; freeform surface; chemical mechanical polishing
Dr. Yang Yang

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Guest Editor
School of Mechanical Engineering and Automation, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
Interests: micromachining; ultra-precision machining; vibration-assisted machining; functional engineering surfaces; miniature tool design

Special Issue Information

Dear Colleagues,

Microstructured surfaces are critical in advancing technologies across various sectors, including electronics, optics, and biomedical devices. As industries are increasingly demanding components with complex geometries and superior surface finishes, ultra-precision manufacturing techniques are essential. This Special Issue aims to explore the development and applications of machining processes for microstructured surfaces, such as precision machining, advanced abrasive techniques, molding, and hybrid processing approaches. We encourage submissions that provide insights into theoretical frameworks, experimental investigations, and practical applications that demonstrate the effectiveness of these techniques. By bringing together researchers and practitioners, this Special Issue hopes to foster knowledge exchange and stimulate further research in the manufacturing of microstructured surfaces.

Dr. Jiang Guo
Dr. Yanjun Lu
Dr. Zili Zhang
Dr. Yang Yang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • microstructured surface
  • cutting
  • grinding
  • milling
  • polishing
  • molding

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Published Papers (5 papers)

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Research

15 pages, 12323 KB  
Article
Research on Machining Characteristics of C/SiC Composite Material by EDM
by Peng Yu, Ziyang Yu, Lize Wang, Yongcheng Gao, Qiang Li and Yiquan Li
Micromachines 2025, 16(12), 1423; https://doi.org/10.3390/mi16121423 - 18 Dec 2025
Abstract
Carbon fiber reinforced silicon carbide (C/SiC) composite material exhibits exceptional properties, including high strength, high stiffness, low density, outstanding high-temperature performance, and corrosion resistance. Consequently, they are widely used in aerospace, defense, and automotive engineering. However, their anisotropic, high hardness, and brittle characteristics [...] Read more.
Carbon fiber reinforced silicon carbide (C/SiC) composite material exhibits exceptional properties, including high strength, high stiffness, low density, outstanding high-temperature performance, and corrosion resistance. Consequently, they are widely used in aerospace, defense, and automotive engineering. However, their anisotropic, high hardness, and brittle characteristics make them a typical difficult-to-machine material. This paper focuses on achieving high-quality micro hole machining of C/SiC composite material via electrical discharge machining. It systematically investigates electrical discharge machining characteristics and innovatively develops a hollow internal flow helical electrode reaming process. Experimental results reveal four typical chip morphologies: spherical, columnar, blocky, and molten. The study uncovers a multi-mechanism cutting process: the EDM ablation of the composite involves material melting and explosive vaporization, the intact extraction and fracture of carbon fibers, and the brittle fracture and spalling of the SiC matrix. Discharge energy correlates closely with surface roughness: higher energy removes more SiC, resulting in greater roughness, while lower energy concentrates on m fibers, yielding higher vaporization rates. C fiber orientation significantly impacts removal rates: processing time is shortest at θ = 90°, longest at θ = 0°, and increases as θ decreases. Typical defects such as delamination were observed between alternating 0° and 90° fiber bundles or at hole entrances. Cracks were also detected at the SiC matrix–C fiber interface. The proposed hole-enlargement process enhances chip removal efficiency through its helical structure and internal flushing, reduces abnormal discharges, mitigates micro hole taper, and thereby improves forming quality. This study provides practical references for the EDM of C/SiC composite material. Full article
(This article belongs to the Special Issue Novel Processes for Cutting, Grinding and Polishing of Microstructured Surfaces)
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18 pages, 8768 KB  
Article
Simulation Analysis of the Chemical Mechanical Polishing Process for Monocrystal 4H-Silicon Carbide Based on Molecular Dynamics
by Yang Lei, Weigang Guo, Kaiping Feng and Zitong Sun
Micromachines 2025, 16(12), 1350; https://doi.org/10.3390/mi16121350 - 28 Nov 2025
Viewed by 357
Abstract
This paper delves into the mechanism of the chemical and mechanical action during chemical mechanical polishing (CMP) of monocrystal silicon carbide (SiC) through the molecular dynamics (MD) method. The oxidation simulation showed that the Si atoms mainly reacted in the form of Si-O [...] Read more.
This paper delves into the mechanism of the chemical and mechanical action during chemical mechanical polishing (CMP) of monocrystal silicon carbide (SiC) through the molecular dynamics (MD) method. The oxidation simulation showed that the Si atoms mainly reacted in the form of Si-O and Si-H, while the C atoms are in the form of C-O. The impact of the sliding depth and the polishing speed on the SiC workpiece was analyzed. Results show that more substrate atoms are removed as the polishing depth and speed increase. When the polishing depth reached 8 angstroms, 624 atoms were removed from the substrate. At the same time, the increased diamond polishing speed expands the polishing area. This reduces the indentation of the cut atoms on the surface of the workpiece and increases the removal efficiency of the SiC surface atoms, and when the polishing speed reached 125 m/s, the instantaneous temperature reached about 800 °C. In short, the polishing depth and speed have a significant impact on the polishing process, and the polishing depth has a more sophisticated influence on the atom removal rate. Full article
(This article belongs to the Special Issue Novel Processes for Cutting, Grinding and Polishing of Microstructured Surfaces)
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18 pages, 9219 KB  
Article
Ultrasonic Vibration-Assisted Micro-Electrical Discharge Machining Characteristics and Parameter Optimization of C/SiC Composites
by Peng Yu, Lize Wang, Yongcheng Gao, Qiang Li and Yiquan Li
Micromachines 2025, 16(11), 1257; https://doi.org/10.3390/mi16111257 - 4 Nov 2025
Cited by 1 | Viewed by 581
Abstract
Carbon-fiber-reinforced silicon carbide (C/SiC) composite materials, as a kind of composite material with the characteristics of ceramics, have the following characteristics: high strength, high stiffness, low density, high temperature resistance, and high corrosion resistance. These characteristics make them widely applicable in aerospace, defense, [...] Read more.
Carbon-fiber-reinforced silicon carbide (C/SiC) composite materials, as a kind of composite material with the characteristics of ceramics, have the following characteristics: high strength, high stiffness, low density, high temperature resistance, and high corrosion resistance. These characteristics make them widely applicable in aerospace, defense, automotive, and other high-performance industries. However, because of their anisotropy and inherent brittleness, ceramic-based composites are still difficult to process using conventional processing techniques. In this study, a technique of ultrasonic vibration-assisted micro-electrical discharge machining (micro-EDM) for the precise machining of two-dimensional (2D) C/SiC composites was proposed. The research mainly focused on an investigation of the material removal mechanism of C/SiC composites under ultrasonic vibration-assisted micro-EDM conditions. The erosion process was found to involve melting and vaporization of the SiC matrix, whereas the carbon fibers were removed by fragmentation and localized melting. In order to assess the effects of various process parameters on the material removal rate (MRR), single-factor experiments were performed initially. Afterwards, response surface methodology was used to optimize the MRR of C/SiC composites during ultrasonic vibration-assisted micro-EDM. A Plackett–Burman (PB) design was used to determine the parameters that have a significant effect on MRR. Based on these results, the optimum parameter range was obtained using the method of steepest ascent. Finally, a Box–Behnken design was used to determine the best machining parameters for improved performance. Full article
(This article belongs to the Special Issue Novel Processes for Cutting, Grinding and Polishing of Microstructured Surfaces)
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12 pages, 1130 KB  
Article
Experimental Study on Abrasive Flow Polishing of Grooves and Oil Holes of Aircraft Engine Main Bearing
by Qinghao Zhang, Jikun Yu and Mingyu Wu
Micromachines 2025, 16(10), 1139; https://doi.org/10.3390/mi16101139 - 1 Oct 2025
Viewed by 536
Abstract
This study addresses the challenges in machining the raceways and oil holes of aircraft engine bearing rings by conducting abrasive flow machining experiments on main bearing rings which had undergone ultra-precision grinding. Viscoelastic abrasive media containing cubic boron nitride of different particle sizes [...] Read more.
This study addresses the challenges in machining the raceways and oil holes of aircraft engine bearing rings by conducting abrasive flow machining experiments on main bearing rings which had undergone ultra-precision grinding. Viscoelastic abrasive media containing cubic boron nitride of different particle sizes is used during the experiments. The results show that bearing performance is improved significantly in terms of surface roughness and residual compressive stress consequently; the overall surface quality is raised. The machining process meets the precision requirements for the main bearings of this type of aircraft engine, validating the feasibility and effectiveness of Abrasive Flow Machining (AFM), and the foundation for further optimization of this process is set through this research. Full article
(This article belongs to the Special Issue Novel Processes for Cutting, Grinding and Polishing of Microstructured Surfaces)
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11 pages, 2762 KB  
Article
Study on the Low-Damage Material Removal Mechanism of Silicon Carbide Ceramics Under Longitudinal–Torsional Ultrasonic Grinding Conditions
by Junli Liu, Zhenqi Ma, Yanyan Yan, Dengke Yuan and Yifan Wang
Micromachines 2025, 16(9), 1048; https://doi.org/10.3390/mi16091048 - 13 Sep 2025
Cited by 1 | Viewed by 832
Abstract
In order to achieve the high-performance machining of silicon carbide (SiC) ceramics, longitudinal–torsional ultrasonic vibration (LTUV) was introduced into precision machining, and a systematic investigation into the effects of various process parameters on the critical cutting depth and surface quality was conducted. This [...] Read more.
In order to achieve the high-performance machining of silicon carbide (SiC) ceramics, longitudinal–torsional ultrasonic vibration (LTUV) was introduced into precision machining, and a systematic investigation into the effects of various process parameters on the critical cutting depth and surface quality was conducted. This investigation was undertaken with a view to exploring the ultrasonic vibration-assisted grinding mechanism of SiC ceramics. Firstly, the kinematic model of single abrasive grain trajectory and the maximum unaltered cutting thickness during longitudinal–torsional ultrasonic vibration-assisted grinding (LTUVG) was established to explore its unique grinding characteristics. On this basis, the theoretical modeling of critical cutting depth in SiC ceramics under LTUVG conditions was developed. This was then verified through longitudinal–torsional ultrasonic scratching (LTUS) experiments, and the theoretical analysis and test results prove that compared with normal scratching, the quality of SiC grooves are significantly improved by means of LTUS. During LTUS experiments, the dynamic fracture toughness, strain rate of SiC, and high-frequency ultrasonic excitation significantly enhances SiC performance, increasing the critical cutting depth and expanding the plastic removal region, so it is easy for LTUVG to yield the better surface quality in machined SiC ceramics, which provides important scholarly support for achieving the low-damage machining of SiC ceramics. Full article
(This article belongs to the Special Issue Novel Processes for Cutting, Grinding and Polishing of Microstructured Surfaces)
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