materials-logo

Journal Browser

Journal Browser

Properties and Structural Evaluation of Joining Processes

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: closed (20 December 2022) | Viewed by 4194

Special Issue Editors


E-Mail Website
Guest Editor
Department of Engineering, University of Messina, Contrada di Dio 1, 98166 Messina, Italy
Interests: adhesive joints; metal forming; mechanical characterization of composite materials

E-Mail Website
Guest Editor
Department of Engineering, University of Messina, Contrada di Dio, Messina, Italy
Interests: additive manufacturing; joining; dissimilar materials; composites; FEA
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

In the last decades in the field of joining processes, numerous innovations and novel techniques have been developed since more and more new materials need to be connected in permanent or non-permanent ways in both industrial and civil application. The necessity of fuel consumption reduction has led to the use of ever lighter structures and/or the desertion of the use of techniques that increase the total weight of the structure itself. Moreover, the techniques to be employed should be less energy consuming and less polluting. The modern scenario shows a variety of solutions that still have to be validated, and for which it is necessary to develop design instruments for the correct application of the joining techniques.

Among the others, friction stir welding, self-piercing riveting, laser welding, adhesive joining, clinching, etc., are examples of techniques that are largely employed, but by varying the application field and the materials/thickness involved, it is not easily possible to predict the properties of the final joint.

The research community is involved in the development of testing methods, designing processes useful for the better usage of the joining process for each field of interest.

This Special Issue is addressed to the inquire about recent developments in the field of the Properties and Structural Evaluation of Joining Processes, in order to the understanding both the mechanisms underlying the formation of the joints and the behaviour of these last under the various stress states that the joint can undergo. The aim is to increase the knowledge, the understanding of the behaviour of junctions, the failure modes, and the field of applicability of the various techniques.

The articles presented in this Special Issue will cover various topics, ranging from, but not limited to, the following: properties of different joint configurations (i.e., single lap, double lap, T-joint, etc.) between similar or dissimilar materials (metals and/or composite structures); combination of different joining techniques (i.e., bonding–fastening), finite element analysis of the joining processes, and failure modes.

Dr. Chiara Borsellino
Prof. Dr. Guido Di Bella
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • joining
  • fastening
  • bonding
  • testing
  • finite element analysis

Published Papers (2 papers)

Order results
Result details
Select all
Export citation of selected articles as:

Research

10 pages, 3073 KiB  
Article
Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing
by Zhiwei Fu, Jian Chen, Pengfei Zhao, Xiaotong Guo, Qingzhong Xiao, Xing Fu, Jian Wang, Chao Yang, Jile Xu and Jia-Yue Yang
Materials 2023, 16(3), 1134; https://doi.org/10.3390/ma16031134 - 28 Jan 2023
Cited by 1 | Viewed by 1299
Abstract
The electromigration behavior of microbumps is inevitably altered under bidirectional currents. Herein, based on a designed test system, the effect of current direction and time proportion of forward current is investigated on Cu Pillar/Ni/Sn-1.8 Ag/Cu microbumps. Under thermo-electric stressing, microbumps are found to [...] Read more.
The electromigration behavior of microbumps is inevitably altered under bidirectional currents. Herein, based on a designed test system, the effect of current direction and time proportion of forward current is investigated on Cu Pillar/Ni/Sn-1.8 Ag/Cu microbumps. Under thermo-electric stressing, microbumps are found to be susceptible to complete alloying to Cu6Sn5 and Cu3Sn. As a Ni layer prevents the contact of the Cu pillar with the solder, Sn atoms mainly react with the Cu pad, and the growth of Cu3Sn is concentrated on the Cu pad sides. With direct current densities of 3.5 × 104 A/cm2 at 125 °C, the dissolution of a Ni layer on the cathode leads to a direct contact reaction between the Cu pillar and the solder, and the consumption of the Cu pillar and the Cu pad shows an obvious polarity difference. However, with a bidirectional current, there is a canceling effect of an atomic electromigration flux. With current densities of 2.5 × 104 A/cm2 at 125 °C, as the time proportion of the forward current approaches 50%, a polarity structural evolution will be hard to detect, and the influence of the chemical flux on Cu-Sn compounds will be more obvious. The mechanical properties of Cu/Sn3.0Ag0.5Cu/Cu are analyzed at 125 °C with direct and bidirectional currents of 1.0 × 104 A/cm2. Compared with high-temperature stressing, the coupled direct currents significantly reduced the mechanical strength of the interconnects, and the Cu-Sn compound layers on the cathode became the vulnerable spot. While under bidirectional currents, as the canceling effect of the electromigration flux intensifies, the interconnect shear strength gradually increases, and the fracture location is no longer concentrated on the cathode sides. Full article
(This article belongs to the Special Issue Properties and Structural Evaluation of Joining Processes)
Show Figures

Figure 1

16 pages, 6729 KiB  
Article
Effect of Stiffening the Printed Circuit Board in the Fatigue Life of the Solder Joint
by Sushil Doranga, Matthew Schuldt and Mukunda Khanal
Materials 2022, 15(18), 6208; https://doi.org/10.3390/ma15186208 - 07 Sep 2022
Cited by 6 | Viewed by 2320
Abstract
Predictive analysis of the life of an electronic package requires a sequence of processes involving: (i) development of a finite element (FE) model, (ii) correlation of the FE model using experimental data, and (iii) development of a local model using the correlated FE [...] Read more.
Predictive analysis of the life of an electronic package requires a sequence of processes involving: (i) development of a finite element (FE) model, (ii) correlation of the FE model using experimental data, and (iii) development of a local model using the correlated FE model. The life of the critical components is obtained from the local model and is usually compared to the experimental results. Although the specifics of such analyses are available in the literature, a comparison among them and against the same electronic package with different user printed circuit board (PCB) thicknesses does not exist. This study addresses the issues raised during the design phase/life analysis, by considering a particular package with a variable geometric thickness of the user PCB. In this paper, the effect of stiffening the user PCB on the fatigue life of a ball grid array (BGA), SAC305 solder joint is studied. The board stiffness was varied by changing the thickness of the PCB, while the size of the substrate, chips, and solder balls were kept constant. The test vehicle consisted of BGA chips soldered to a user PCB. The thickness of the user PCB was varied, but the surface area of the BGA chip remained identical. The test vehicle was then modeled using a finite element analysis tool (ANSYS). Using a global/local modeling approach, the modal parameters in the simulations were correlated with experimental data. The first resonance frequency dwell test was carried out in ANSYS, and the high-cycle fatigue life was estimated using the stress-life approach. Following the simulation, the test vehicle was subjected to resonance fatigue testing by exciting at the first mode resonance frequency, the mode with the most severe solder joint failure. The resistance of the solder joint during the experiment was monitored using a daisy-chain circuit, and the point of failure was further confirmed using the destructive evaluation technique. Both the experimental and simulation results showed that stiffening the board will significantly increase the fatigue life of the solder joint. Although the amplitude of the acceleration response of the test vehicle will be higher due to board stiffening, the increase in natural frequencies will significantly reduce the amplitude of relative displacement between the PCB and the substrate. Full article
(This article belongs to the Special Issue Properties and Structural Evaluation of Joining Processes)
Show Figures

Figure 1

Back to TopTop