Special Issue "Challenges in Additive Manufacturing: From Coupon Studies to Components"
Deadline for manuscript submissions: closed (10 January 2022) | Viewed by 11185
Interests: additive manufacturing; material characterization; processing and part manufacturing strategies; process monitoring; titanium alloys, surfaces and interfaces; surface chemistry and physics; adhesive bonding; theoretical modelling; density functional theory
Additive manufacturing (AM) of metallic materials still faces serious hurdles that need to be overcome before a widespread utilisation, particularly for highly loaded and safety-relevant components, can be achieved. A variety of technologies, such as laser powder bed fusion, direct energy deposition and metal binder jetting, are available today and new approaches, such as multi-material printing, are under development.
On the coupon level, efforts are being made to address challenges in processing strategies and materials characterisation. In this respect, much potential is recognised in the development of novel alloys tailored to the metallurgical conditions that prevail in AM.
Another crucial step in AM is to transfer the knowledge that is obtained from these fundamental studies to component manufacturing while acknowledging the role that local part geometry plays in the resulting thermal history and material properties. Individual and often complex build, processing and post-treatment strategies must be developed. Simulations of AM processes are underway that can enhance our understanding of AM materials and guide the development of component manufacturing strategies.
This Special Issue shall be dedicated to new developments in metal and multi-material AM, encompassing (yet not limited to):
- materials properties–process relationships;
- multi-material AM and new AM approaches;
- process modelling, simulations and digitalisation;
- in operando process monitoring;
- alloy development for AM;
- transfer of process and materials knowledge from coupons to components;
- component manufacturing: build and post-processing strategies; and
- material characterisation in complex AM components.
I invite you to contribute original, high-quality submissions to this Special Issue. Regular and review articles as well as short communications from materials research, theoretical modelling, engineering and process simulation are welcome.
Dr. Jan Haubrich
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2300 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- additive manufacturing (AM)
- laser-, electron- and sintering-based AM techniques
- hybrid additive manufacturing
- manufacturing chains: part-specific build and post-treatment strategies
- materials characterisation (e.g., defects, microstructure, texture, residual stress, surface properties)
- special scanning and processing strategies (including high-temperature processing)
- heat and surface post-treatments
- in operando monitoring
- part and materials validation
- process modeling and simulation
- quantum-chemical materials design