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Plasma Diagnostics and Discharge Physics for Materials Processing
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Plasma Diagnostics and Discharge Physics for Materials Processing

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: closed (20 October 2023) | Viewed by 7100

Special Issue Editor

Prof. Dr. Shin Jae You

E-Mail Website
Guest Editor
Applied Physics Lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Daejeon 34134, Korea
Interests: plasma diagnostics; plasma processing and its mechanism; plasma source development; plasma sensor development; plasma parameter/process control; plasma fault detection and classification (FDC); plasma levitation and nanoparticle synthesis

Special Issue Information

Dear Colleagues,

Plasmas, comprising energetically charged particles and high reactive neutrals, have played a key role in state-of-the-art material processing, such as surface processing, material fabrication, and particle synthesis. Due to the complicated and diverging nature of processing steps, a sophisticated understanding of discharge physics and chemistry based on plasma diagnostics is greatly needed, which has attracted huge interest from industrial and research fields.

To study factors and indicators, which directly influence processing quality and efficiency, numerous plasma diagnostics have been developed, including: electrostatic probes, microwave probes, optical emission/absorption spectroscopy, mass spectroscopy, laser method, etc. These diagnostics have contributed to optimization, improvement, and development of material processing through elucidating the mechanisms underlying processing.

This Special Issue aims to present recent developments in plasma diagnostics and findings related to discharge physics for material processing. The Issue will cover various diagnostic methods and discharge physics for material processing utilizing plasma under either non-thermal equilibrium (non-LTE) or LTE conditions, regardless of operation pressure, such as plasma etching/deposition, plasma-enhanced atomic layer etching/deposition, surface coating/modification, particle/material synthesis, plasma catalysis, plasma combustion, plasma nitridation, etc.

Prof. Dr. Shin Jae You
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (5 papers)

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Research

12 pages, 1817 KiB  
Article
Study on OH Radical Production Depending on the Pulse Characteristics in an Atmospheric-Pressure Nanosecond-Pulsed Plasma Jet
by Youbin Seol, Minsu Choi, Hongyoung Chang and Shinjae You
Materials 2023, 16(10), 3846; https://doi.org/10.3390/ma16103846 - 19 May 2023
Viewed by 962
Abstract
Hydroxyl radicals (OH) play a crucial role in plasma-bio applications. As pulsed plasma operation is preferred, and even expanded to the nanosecond range, it is essential to study the relationship between OH radical production and pulse characteristics. In this study, we use optical [...] Read more.
Hydroxyl radicals (OH) play a crucial role in plasma-bio applications. As pulsed plasma operation is preferred, and even expanded to the nanosecond range, it is essential to study the relationship between OH radical production and pulse characteristics. In this study, we use optical emission spectroscopy to investigate OH radical production with nanosecond pulse characteristics. The experimental results reveal that longer pulses generate more OH radicals. To confirm the effect of pulse properties on OH radical generation, we conduct computational chemical simulations, focusing on two types of pulse properties: pulse instant power and pulse width. The simulation results show that, similar to the experimental results, longer pulses generate more OH radicals. In the nanosecond range, reaction time is critical for OH radical generation. In terms of chemical aspects, N2 metastable species mainly contribute to OH radical generation. It is a unique behavior observed in nanosecond range pulsed operation. Furthermore, humidity can turn over the tendency of OH radical production in nanosecond pulses. In a humid condition, shorter pulses are advantageous for generating OH radicals. Electrons play key roles in this condition and high instant power contributes to them. Full article
(This article belongs to the Special Issue Plasma Diagnostics and Discharge Physics for Materials Processing)
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8 pages, 1569 KiB  
Article
Atomic Layer Etching Using a Novel Radical Generation Module
by Junho Jung and Kyongnam Kim
Materials 2023, 16(10), 3611; https://doi.org/10.3390/ma16103611 - 9 May 2023
Cited by 1 | Viewed by 1380
Abstract
To fabricate miniature semiconductors of 10 nm or less, various process technologies have reached their physical limits, and new process technologies for miniaturization are required. In the etching process, problems such as surface damage and profile distortion have been reported during etching using [...] Read more.
To fabricate miniature semiconductors of 10 nm or less, various process technologies have reached their physical limits, and new process technologies for miniaturization are required. In the etching process, problems such as surface damage and profile distortion have been reported during etching using conventional plasma. Therefore, several studies have reported novel etching techniques such as atomic layer etching (ALE). In this study, a new type of adsorption module, called the radical generation module, was developed and applied in the ALE process. Using this module, the adsorption time could be reduced to 5 s. Moreover, the reproducibility of the process was verified and an etch per cycle of 0.11 nm/cycle was maintained as the process progressed up to 40 cycles. Full article
(This article belongs to the Special Issue Plasma Diagnostics and Discharge Physics for Materials Processing)
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9 pages, 536 KiB  
Article
On the Quenching of Electron Temperature in Inductively Coupled Plasma
by Inho Seong, Si-jun Kim, Youngseok Lee, Chulhee Cho, Wonnyoung Jeong, Yebin You, Minsu Choi, Byeongyeop Choi and Shinjae You
Materials 2023, 16(8), 3219; https://doi.org/10.3390/ma16083219 - 19 Apr 2023
Cited by 1 | Viewed by 953
Abstract
Electron temperature has attracted great attention in plasma processing, as it dominates the production of chemical species and energetic ions that impact the processing. Despite having been studied for several decades, the mechanism behind the quenching of electron temperature with increasing discharge power [...] Read more.
Electron temperature has attracted great attention in plasma processing, as it dominates the production of chemical species and energetic ions that impact the processing. Despite having been studied for several decades, the mechanism behind the quenching of electron temperature with increasing discharge power has not been fully understood. In this work, we investigated the quenching of electron temperature in an inductively coupled plasma source using Langmuir probe diagnostics, and suggested a quenching mechanism based on the skin effect of electromagnetic waves within local- and non-local kinetic regimes. This finding provides insight into the quenching mechanism and has implications for controlling electron temperature, thereby enabling efficient plasma material processing. Full article
(This article belongs to the Special Issue Plasma Diagnostics and Discharge Physics for Materials Processing)
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11 pages, 594 KiB  
Article
Determination of Plasma Potential Using an Emissive Probe with Floating Potential Method
by Chulhee Cho, Sijun Kim, Youngseok Lee, Inho Seong, Wonnyoung Jeong, Yebin You, Minsu Choi and Shinjae You
Materials 2023, 16(7), 2762; https://doi.org/10.3390/ma16072762 - 30 Mar 2023
Cited by 2 | Viewed by 1351
Abstract
Despite over 90 years of study on the emissive probe, a plasma diagnostic tool used to measure plasma potential, its underlying physics has yet to be fully understood. In this study, we investigated the voltages along the hot filament wire and emitting thermal [...] Read more.
Despite over 90 years of study on the emissive probe, a plasma diagnostic tool used to measure plasma potential, its underlying physics has yet to be fully understood. In this study, we investigated the voltages along the hot filament wire and emitting thermal electrons and proved which voltage reflects the plasma potential. Using a circuit model incorporating the floating condition, we found that the lowest potential on the plasma-exposed filament provides a close approximation of the plasma potential. This theoretical result was verified with a comparison of emissive probe measurements and Langmuir probe measurements in inductively coupled plasma. This work provides a significant contribution to the accurate measurement of plasma potential using the emissive probe with the floating potential method. Full article
(This article belongs to the Special Issue Plasma Diagnostics and Discharge Physics for Materials Processing)
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22 pages, 7057 KiB  
Article
Energy Efficiency Enhancement of Inductively Coupled Plasma Torch: Computational Study
by Samira Elaissi, Amira Ben Gouider Trabelsi, Fatemah H. Alkallas, Tahani A. Alrebdi and Kamel Charrada
Materials 2022, 15(15), 5213; https://doi.org/10.3390/ma15155213 - 28 Jul 2022
Cited by 1 | Viewed by 2058
Abstract
In this research, we studied the performance analysis of inductively coupled radiofrequency plasma “RF-ICP” torch used in multi-material processing. A 2D numerical model built with COMSOL Multiphysics was used to study the discharge behavior and evaluate the overall efficiency transmitted into the plasma [...] Read more.
In this research, we studied the performance analysis of inductively coupled radiofrequency plasma “RF-ICP” torch used in multi-material processing. A 2D numerical model built with COMSOL Multiphysics was used to study the discharge behavior and evaluate the overall efficiency transmitted into the plasma system. The temperature and velocity flow of the plasma were investigated. The numerical results are consistent with previous experimental studies. The temperature and velocity profiles are represented under a wide range of RF power and for different sheath gas flow rates. With increasing power, the radial peak temperature typically shifts towards the wall. The resistance of the torch rises whereas the inductance diminishes with increasing RF power. The overall dependency of the coupling efficiency to the RF power is also estimated. The stabilization of the plasma flow dependency to the sheath swirl flow was investigated. The incorporation of Helium (0.02%) into an Argon gas was established to minimize the energy lost in the sidewall. The number and spacing of induction coil numbers affects the temperature and flow field distribution. A valuable approach to designing and optimizing the induction plasma system is presented in the proposed study. The obtained results are fundamental to specify ICP torch design criteria needed for multi-material processing. Full article
(This article belongs to the Special Issue Plasma Diagnostics and Discharge Physics for Materials Processing)
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