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- 6.1CiteScore
- 17 daysTime to First Decision
Special Issues
Electronics publishes Special Issues to create collections of papers on specific topics, with the aim of building a community of authors and readers to discuss the latest research and develop new ideas and research directions. Special Issues are led by Guest Editors, who are experts on the topic and all Special Issue submissions follow MDPI's standard editorial process.
The journal’s Editor-in-Chief and/or designated Editorial Board Member will oversee Guest Editor appointments and Special Issue proposals, checking their content for relevance and ensuring the suitability of the material for the journal. The papers published in a Special Issue will be collected and displayed on a dedicated page of the journal’s website. Further information on MDPI's Special Issue polices and Guest Editor responsibilities can be found here. For any inquiries related to a Special Issue, please contact the Editorial Office.
Antennas and RF Circuits on Biobased Substrates: Development, Performance and Integration
Deadline: 15 June 2026
Antennas for IoT Devices, 2nd Edition
Deadline: 15 June 2026
Privacy-Preserving Solutions and Technologies for the Big Data Era
Deadline: 15 June 2026
Novel Methods Applied to Security and Privacy Problems in Future Networking Technologies, Volume II
Deadline: 15 June 2026
Advances in Image Recognition, Image Segmentation, Image Fusion, and Singal Processing
Deadline: 15 June 2026
Natural Language Processing: From Deep Learning to Real-World Solutions
Deadline: 15 June 2026
Emerging Computing Paradigms for Efficient Edge AI Acceleration
Deadline: 15 June 2026
Advances in Text Mining and Analytics
Deadline: 15 June 2026
Virtual Reality Technology, Systems and Applications
Deadline: 15 June 2026
Advances in Cryptography for IoT in the Era of Quantum Computing
Deadline: 15 June 2026
Stability Analysis and Optimal Operation Strategy for Power Systems with High Renewable Energy Penetration
Deadline: 15 June 2026
High-Performance RF Power Amplifiers: The Advancement of GaN, Si, and CMOS for Future Communications
Deadline: 15 June 2026
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