Advanced Internet of Things (IoT): Sensing Techniques, Hardware, and Software Architectures for the Next Generation Internet of Things

Dear Colleagues,

Internet of Things technologies are one of the major drivers of the technological transformation that we are experiencing in practically almost every sector of industry and economy, including smart cities, smart buildings, e-health, smart mobility, smart factories, smart appliances and even education.

The number of interconnected smart devices is increasing exponentially and, according to CISCO, there will be 500 billion interconnected devices by 2030.

This huge number of networked devices entails several design challenges throughout the entire IoT technological stack, including the cost of IoT enabled sensors, ecological impacts due to electronic waste, the exponential increase of data bandwidth requirements and high overall system latency due to the sensor-to-cloud paradigm, network security and data privacy.

In this Special Issue, we aim to collect high-quality submissions that target the most relevant practical engineering, and theoretical aspects behind the next-generation Internet of Things. The topics of interest include but are not limited to:

• Smart sensing low-environmental impact materials for IoT.
• Printable electronics for IoT.
• Hybrid printable-silicon circuits for IoT.
• Energy-scavenging techniques for IoT devices.
• Low-power machine-to-machine protocols and wireless sensor networks.
• Novel fog and edge architectures.
• Embedded AI.
• Novel security techniques for IoT and embedded devices.
• Industrial IoT (IIoT).
• Novel applications of IoT.
• Embedded and IoT security.

Dr. Gianluca Cornetta
Dr. Abdellah Touhafi
Dr. Antonio Mariscal Jiménez
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.