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Electronics
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Advanced Research in Electromagnetic Compatibility Techniques for Electronic Systems
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Advanced Research in Electromagnetic Compatibility Techniques for Electronic Systems

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: 15 November 2026 | Viewed by 1698

Editors

Prof. Dr. Ping Li

E-Mail Website
Guest Editor
School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: computational electromagnetics; multiphysics computation; electromagnetic compatibility; scientific machine learning (SciML)
Dr. Da Li

E-Mail Website
Guest Editor
College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310058, China
Interests: machine learning; metasurfaces; electromagnetic compatibility
Dr. Ling Zhang

E-Mail Website
Guest Editor
College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310058, China
Interests: electromagnetic compatibility; signal integrity; power integrity; machine learning
Dr. Ran Zhao

E-Mail Website
Guest Editor
School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: computational electromagnetics; multiphysics computation

Special Issue Information

Dear Colleagues,

In our increasingly connected world, the proliferation of electronic systems, from Internet of Things (IoT) devices and 5G communication networks to advanced driver-assistance systems (ADASs) and high-density power converters, has created an unprecedentedly complex electromagnetic environment. The performance, reliability, and safety of these systems are fundamentally dependent on their ability to operate without causing or being affected by electromagnetic interference (EMI). As operating frequencies increase, component densities rise, and systems become more integrated, traditional approaches to Electromagnetic Compatibility (EMC) are being pushed to their limits, necessitating innovative research and novel solutions.

The relentless drive towards miniaturization, higher data rates, and greater energy efficiency introduces significant challenges. High-speed digital circuits are more susceptible to signal integrity issues, wide-bandgap semiconductors in power electronics generate faster transients and broader noise spectra, and the sheer number of wireless devices creates a crowded spectrum where interference is a primary concern. Consequently, ensuring EMC is no longer a final-stage validation task but a critical consideration that must be integrated throughout the entire design lifecycle, from material science and component selection to system architecture and validation.

This Special Issue aims to provide a premier international forum for researchers and engineers to present their latest findings, breakthroughs, and review articles on the cutting edge of EMC techniques. We invite contributions that address the growing complexity of modern electronic systems and propose forward-thinking solutions.

Topics of interest for publication include, but are not limited to, the following:

(1) Advanced EMI shielding materials, metamaterials, and absorbing structures;

(2) Novel techniques for EMI filtering and noise suppression;

(3) Advanced numerical modeling, simulation, and machine learning for EMC analysis;

(4) EMC/EMI and signal/power integrity in high-speed digital systems;

(5) EMC challenges and solutions for power electronics, especially with SiC and GaN devices;

(6) EMC in wireless communication systems, 5G/6G technologies, and IoT networks;

(7) Advanced EMC measurement techniques and test methodologies;

(8) System-level EMC design, management, and co-design methodologies;

(9) Protection against electrostatic discharge (ESD), lightning, and other transient phenomena;

(10) Application-specific EMC for emerging technologies.

We look forward to receiving your valuable contributions to this exciting and critically important field.

Prof. Dr. Ping Li
Dr. Da Li
Dr. Ling Zhang
Dr. Ran Zhao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • EMC/EMI
  • SI/PI
  • shielding
  • electromagnetic absorbers
  • computational electromagnetics
  • machine learning
  • EMC measurement

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Published Papers (3 papers)

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18 pages, 6375 KB  
Article
Experimental Electromagnetic Shielding Analysis of a Square-Resonator-Integrated Double-Concrete Structure Using Explainable Machine Learning
by Mehmet Cakir
Electronics 2026, 15(12), 2742; https://doi.org/10.3390/electronics15122742 - 22 Jun 2026
Viewed by 146
Abstract
Electromagnetic shielding has become a practical concern in buildings and structures exposed to persistent interference. This paper reports experimental measurements of the frequency-dependent shielding properties of a square-resonator-integrated double-concrete structure, using a free-space S-parameter setup built around WR229 waveguide adaptors and horn antennas. [...] Read more.
Electromagnetic shielding has become a practical concern in buildings and structures exposed to persistent interference. This paper reports experimental measurements of the frequency-dependent shielding properties of a square-resonator-integrated double-concrete structure, using a free-space S-parameter setup built around WR229 waveguide adaptors and horn antennas. Three variables were tested: concrete thickness D, relative permittivity εr, and relative magnetic permeability μr. Both εr and μr were characterized experimentally from carbon-fibre- and copper-slag-modified concrete rather than taken from standard tables. The novelty of the study lies in combining experimentally characterized concrete electromagnetic properties, an embedded square-resonator geometry, and explainability-driven machine learning analysis within a single experimental framework for cement-based EMI shielding design. A total of 96 parameter combinations were evaluated using calibrated S11 and reference-corrected S21 responses across 3.3–4.9 GHz. Thickness and electromagnetic material properties interacted—neither governed shielding performance on its own. The strongest transmission attenuation occurred at D = 5, εr = 7, and μr = 1.2, where minimum S21 reached approximately −62.98 dB at 3.6392 GHz. S11 varied considerably less than S21 across the tested combinations, suggesting transmission suppression is the dominant mechanism rather than reflection enhancement. A machine learning analysis confirmed that nonlinear ensemble models outperformed the linear baseline and identified thickness as the most influential predictor of minimum S21. Full article
(This article belongs to the Special Issue Advanced Research in Electromagnetic Compatibility Techniques for Electronic Systems)
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19 pages, 28180 KB  
Article
Hybrid Evolutionary Optimization of Coupling-Corrected Equivalent Sources for Anechoic Replication of Outdoor Electromagnetic Fields
by Yidi Hu, Yujie Qi, Kuiyuan Wang, Hongbin Chen, Jiewen Deng, Kai Zhang, Han Liu and Tianwu Li
Electronics 2026, 15(7), 1436; https://doi.org/10.3390/electronics15071436 - 30 Mar 2026
Viewed by 411
Abstract
We propose a coupling-aware equivalent source reconstruction framework for reproducing complex three-dimensional electromagnetic (EM) environments inside an anechoic chamber. A measured or simulated target field is represented by a finite set of physically realizable equivalent source antennas whose positions and complex excitations are [...] Read more.
We propose a coupling-aware equivalent source reconstruction framework for reproducing complex three-dimensional electromagnetic (EM) environments inside an anechoic chamber. A measured or simulated target field is represented by a finite set of physically realizable equivalent source antennas whose positions and complex excitations are identified by solving a nonlinear high-dimensional inverse problem. To ensure physical fidelity, the forward model explicitly accounts for mutual coupling through a full-wave Method-of-Moments (MoM) formulation, avoiding the inaccuracies of idealized uncoupled superposition. The inverse problem is efficiently solved using a hybrid evolutionary optimization scheme that combines an adaptive differential evolution strategy with stagnation-triggered CMA-ES refinement, augmented by a lightweight surrogate-based pre-screening to reduce expensive full-wave evaluations. The optimized source configuration is directly deployed in a microwave anechoic chamber, where the reconstructed field is measured on an observation plane and compared against the target field. The experimental results demonstrate close agreement in both amplitude and spatial distribution, while the proposed optimization pipeline substantially reduces the number of full-wave evaluations required for convergence. This work enables accurate repeatable chamber emulation of outdoor or in situ EM scenarios for robust system-level testing and evaluation. Full article
(This article belongs to the Special Issue Advanced Research in Electromagnetic Compatibility Techniques for Electronic Systems)
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19 pages, 8328 KB  
Article
A Robust 3D Active Learning Framework Based on Multi-Metric Voting for Fast Electromagnetic Field Reconstruction with Sparse Sampling
by Yidi Hu, Kuiyuan Wang, Yujie Qi, Jiewen Deng, Kai Zhang, Zhi Tang, Lei Zhang and Tianwu Li
Electronics 2026, 15(7), 1434; https://doi.org/10.3390/electronics15071434 - 30 Mar 2026
Viewed by 668
Abstract
To mitigate the high measurement costs in electromagnetic compatibility (EMC) assessment, this paper proposes a robust active learning framework for fast 3D field reconstruction with sparse sampling. A novel “Four-Vote” query criterion is proposed to guide intelligent sample selection, which integrates Shannon entropy, [...] Read more.
To mitigate the high measurement costs in electromagnetic compatibility (EMC) assessment, this paper proposes a robust active learning framework for fast 3D field reconstruction with sparse sampling. A novel “Four-Vote” query criterion is proposed to guide intelligent sample selection, which integrates Shannon entropy, committee variance, spatial density, and clustering-based representativeness, all derived from a heterogeneous radial basis function (RBF) committee. Furthermore, an adaptive polynomial degree adjustment mechanism is implemented to ensure stability in data-scarce 3D environments. Validated through full-wave HFSS simulations, the proposed method significantly outperforms traditional sampling strategies in both 2D and 3D scenarios, achieving high-fidelity field reconstruction with minimal sampling points. This framework provides an efficient solution for rapid spatial field mapping and EMC fault diagnosis in practical engineering scenarios. Full article
(This article belongs to the Special Issue Advanced Research in Electromagnetic Compatibility Techniques for Electronic Systems)
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