Special Issue "Virtual and Augmented Reality Systems"

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Computing and Artificial Intelligence".

Deadline for manuscript submissions: 31 May 2021.

Special Issue Editors

Prof. Chang-Hun Kim
Website
Guest Editor
Department of Computer Science & Engineering, Korea University, Seoul, 02841, Republic of Korea
Interests: VR/AR; CG; visual simulation
Prof. Soo Kyun Kim
Website
Guest Editor
Department of Computer Engineering, Jeju National University, Jeju, 63243, Republic of Korea
Interests: geometric modeling; VR/AR; MR

Special Issue Information

Dear Colleagues,

This Special Issue of the journal of Applied Sciences entitled “Virtual and Augmented Reality Systems” aims to present recent advances in virtual and augmented reality. Virtual and augmented reality is a form of human–computer interaction in which a real or imaginary environment is simulated and users interact with and manipulate that world. Virtual and augmented reality systems have emerged as a disruptive technology to enhance the performance of existing computer graphic techniques and to tackle the related intractable problems in human–computer interactions. Recently, the growing developments in VR/AR technology and hardware such as Oculus Rift, HTC Vive, and smartphone-based HMD have led to an increase in the interest of people in virtual reality. Many related types of research have been published, including graphical simulation, modeling, user interfaces, and AI technologies. This Special Issue is an opportunity for the scientific community to present recent high-quality research works regarding any branch of virtual and augmented reality.

Topics of interest include but are not limited to:

  • Human–computer interactions in the virtual and augmented environment;
  • 3D user interaction in virtual and augmented space;
  • Shared VR and AR technologies;
  • Untact technologies in virtual and augmented space;
  • Graphical simulation for VR and AR systems;
  • AI-based technologies for VR and AR systems;
  • Immersive analytics and visualization;
  • Multiuser and distributed systems;
  • Graphical advancements in virtual and augmented space

Prof. Chang-Hun Kim
Prof. Soo Kyun Kim
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Virtual reality
  • Virtual reality application
  • Virtual reality system
  • Augmented reality
  • Augmented reality application
  • Augmented reality system
  • Human–computer interaction
  • 3D user interfaces (3DUIs)
  • Multisensory experiences
  • Virtual environments
  • AI Problems in VR and AR

Published Papers

This special issue is now open for submission.
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