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Developments in Electronics for High-Energy Physics Experiments

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Applied Physics General".

Deadline for manuscript submissions: 30 January 2026 | Viewed by 14

Special Issue Editor


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Guest Editor
Department of Mining, Industrial and ICT Engineering, Electronics Engineering Section, Universitat Politècnica de Catalunya—BarcelonaTech (UPC), 08242 Manresa, Spain
Interests: ASIC; particle detectors; PET; microelectronics; FPGA; electronics; biomedical; prosthetic implant

Special Issue Information

Dear Colleagues,

Modern high-energy physics experiments are increasingly reliant on electronics, from sensors to signal processing (analog or digital). This poses new challenges in the development of electronics due to the harsh environment (radiation), high-speed data throughput, and low noise requirements of these experiments. Historically, to overcome previous problems, application-specific circuits (ASICs) have been designed, combined with boards populated with components off the shelf (COTS) when possible. In large-scale collaborations, physicists and engineers have teamed up to build next-generation detectors with unprecedentedly high density, precision, and data throughput.

In parallel, programmable devices, usually based on field-programmable gate arrays (FPGAs), are used in the readout and processing chain once the digital data is obtained.

The quantity of devices or boards needed to populate a detector is great enough to consider the complexities of mass production and quality assurance, differing from purely research-based applications.

Therefore, this Special Issue aims to collect novel developments for such applications and will publish high-quality, original research papers, in (but not restricted to) the following overlapping fields:

  • Analog sensor readout chain for high-energy physics detectors;
  • Digitization circuits;
  • Signal processing (analog or digital) for high-energy physics detectors;
  • Readout implementation with components off the shelf (COTS);
  • New sensor development.

Dr. Albert Comerma-Montells
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • ASIC
  • FPGA
  • VLSI
  • COTS
  • SiPM
  • MCP
  • PMT

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Published Papers

This special issue is now open for submission.
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