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Special Issue "Computational Modeling and Artificial Intelligence for Engineering Applications"
A special issue of Applied Sciences (ISSN 2076-3417).
Deadline for manuscript submissions: 15 August 2020.
In recent years, computational modeling and artificial intelligence have been employed widely by scientists to many engineering applications, including exciting advances in understanding the mechanical behaviors of synthetic and biological materials/composites and the development of novel materials, which demonstrate great potential in a wide range of engineering applications for the energy, construction, environment, and biomedical industry. Novel computational modeling techniques and artificial intelligence could lead to breakthroughs for the discovery of new materials and new methods for many engineering applications. The persisting growth of computational modeling and artificial intelligence has strongly reshaped the way scientists resolve and overcome engineering challenges. The integration of computational modeling and artificial intelligence has brought great opportunities for many fields. This Special Issue welcomes high-quality papers that report significant advances on the development and application of computational modeling and artificial intellegence for engineering problems.
Asst. Prof. Dr. Shu-Wei Chang
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- computational modeling
- artificial intelligence
- materials modeling
- data analytics