Thermal and Thermomechanical Management in Electronic Systems
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".
Deadline for manuscript submissions: 30 October 2025 | Viewed by 679
Special Issue Editors
Interests: boiling heat transfer and enhancement under ground and microgravity; microchannel heat sinks; hydrogen energy transportation
Special Issues, Collections and Topics in MDPI journals
Interests: boiling and evaporation heat transfer; loop heat pipes; vapor chambers; thermal management of 5G stations and data centers
Special Issues, Collections and Topics in MDPI journals
Interests: electronic thermal management; two-phase flow; boiling heat transfer; evaporation
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
With the fast development of communication, AI and new energy technologies, thermal management in electronics and batteries is growing more and more important, such as in spacecraft, data centers, 5G stations, mobile devices and batteries in vehicles or energy storage. Hence, high-efficiency cooling methods or devices are urgently needed. This Special Issue welcomes original manuscripts related to the topic of Thermal and Thermomechanical Management in Electronic Systems.
Topics of interest include, but are not limited to, the following:
- Heat and mass transfer;
- Boiling, evaporation and condensation;
- Passive cooling devices like heat pipes, vapor chambers, etc.;
- Active cooling systems like microchannel heat sinks, pump-driven cooling loops, etc.;
- Energy storage and conversion.
Prof. Dr. Yonghai Zhang
Dr. Xiaoping Yang
Prof. Dr. Jiaqi Li
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thermal management
- electronics
- energy storage
- heat and mass transfer
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