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Preface: XXXII Conference on Electrical and Electronic Engineering
 
 
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Editorial

Statement of Peer Review †

1
Department of Electronic Engineering, National Formosa University, Yunlin 632, Taiwan
2
Department of Electrical Engineering, Tamkang University, New Taipei City 251, Taiwan
3
Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan
4
Department of Aeronautical Engineering, Chaoyang University of Technology, Taichung 413, Taiwan
*
Authors to whom correspondence should be addressed.
Presented at the 2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data, Taipei, Taiwan, 19–21 April 2024.
Eng. Proc. 2024, 74(1), 81; https://doi.org/10.3390/engproc2024074081
Published: 12 December 2024
In submitting conference proceedings of the 2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (IEEE ICEIB 2024) to Engineering Proceedings, the volume editors of the proceedings certify to the publisher that all papers published in this volume have been subjected to peer review administered by the volume editors. Reviews were conducted by expert referees to the professional and scientific standards expected of a proceedings journal.
  • Type of peer review: single-blind;
  • Conference submission management system: http://www.iceib.asia/;
  • Number of submissions sent for review: 183;
  • Number of submissions accepted: 80;
  • Acceptance rate: 0.437;
  • Average number of reviews per paper: 2;
  • Total number of reviewers involved: 50;
  • Any additional information on the review process: please refer to Figure 1.
Figure 1. Review process for conference proceedings of the 4th IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2024 (IEEE ICEIB 2024).
Figure 1. Review process for conference proceedings of the 4th IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2024 (IEEE ICEIB 2024).
Engproc 74 00081 g001

Conflicts of Interest

The authors declare no conflicts of interest.
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MDPI and ACS Style

Meen, T.-H.; Liao, S.-H.; Yang, C.-F. Statement of Peer Review. Eng. Proc. 2024, 74, 81. https://doi.org/10.3390/engproc2024074081

AMA Style

Meen T-H, Liao S-H, Yang C-F. Statement of Peer Review. Engineering Proceedings. 2024; 74(1):81. https://doi.org/10.3390/engproc2024074081

Chicago/Turabian Style

Meen, Teen-Hang, Shu-Han Liao, and Cheng-Fu Yang. 2024. "Statement of Peer Review" Engineering Proceedings 74, no. 1: 81. https://doi.org/10.3390/engproc2024074081

APA Style

Meen, T.-H., Liao, S.-H., & Yang, C.-F. (2024). Statement of Peer Review. Engineering Proceedings, 74(1), 81. https://doi.org/10.3390/engproc2024074081

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