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Journal: Electronic MaterialsVolume: 7Number: 19
Article: Wettability and Calculated Work of Adhesion of Bi-Containing SAC305 and SAC405 Solders on ENIG and Cu-OSP Finishes
  • Authors:
  • Zuriel Caribe Couvertier 1,
  • Taylor Venise Douglas 2,3 and
  • Tengfei Jiang 1,*
  • et al.
Link: https://www.mdpi.com/2673-3978/7/3/19

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