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Instruments, Volume 8, Issue 1
March 2024 - 24 articles
Cover Story: Next-generation micro-electronic semiconductor devices will be more complex and three-dimensional, with a nanometer-scale feature size. To guide the manufacturing of these sophisticated devices, powerful non-destructive imaging methods are needed. While it has been shown in proof-of-principle experiments that ptychographic laminography, using coherent hard X-rays, can perform such measurements, the chip-scanning time makes the use of this method impractical at present. This paper presents an attractive solution to this problem by providing a physics-designed hard X-ray free-electron laser based on a regenerative amplifier that yields a coherent flux enhanced by five orders of magnitude. This solution is based on the use of very high-gradient accelerators and short-period undulators. View this paper
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