Review Reports - Review of Nanoscale Precision Shape and Property Control Manufacturing Technology for Monocrystalline Silicon

Round 1

Reviewer 1 Report

Comments and Suggestions for Authors

The caption of Figure 1 was inappropriate, which may be revised as the applications of monocrystalline silicon.
A figure comprising various processing methods and their materials removal mechanisms, characteristics may be added for better readability of this paper.
The hybrid machining processes may be discussed in a single section, and the development trend of nano scale processing of monocrystalline silicon materials should be further discussed.
The classification of Nanoscale Precision Surface Shape Control Manufacturing and defect removal processes may be further explained and schematically illustrated.

Author Response

Dear Reviewers, We would like to extend our sincere gratitude to you for dedicating your precious time, professional expertise and meticulous attention to reviewing our manuscript. Your insightful, constructive comments and targeted suggestions have not only helped us clearly identify the deficiencies in the original draft, but also provided precise guidance for enhancing the rigor, clarity and completeness of our research. We have carefully addressed each of your comments in the revised manuscript, and these revisions have significantly polished the quality of our work. Thank you again for your valuable contributions to refining this paper.

Author Response File: Author Response.pdf

Reviewer 2 Report

Comments and Suggestions for Authors This paper focuses on nanoscale precision shape and property control manufacturing of monocrystalline silicon, covering three core areas: nanoscale surface shape control (e.g., ultra-precision cutting, magnetorheological polishing), intrinsic surface property control (e.g., ion beam processing, plasma etching), and combined control processes. Experiments validate key technologies—for example, magnetorheological polishing limits planar surface shape error to λ/50 (RMS, λ=632.8 nm), and ion beam processing reduces monocrystalline silicon’s surface microcrack density from 12/μm² to 1.5/μm². The paper has a clear framework and provides valuable support for high-precision monocrystalline silicon applications. However, the manuscript requires revisions to address the following issues, aligned with academic formatting and data rigor standards: 1. Non-standard Figure LabelingFigure 1’s caption ("Application scenarios of ultra-precision machining technology") fails to associate sub-elements with specific application fields (e.g., aerospace, laser equipment). Figure 4’s subfigures (a)–(f) correspond to magnetorheological polishing iterations but do not clarify which subfigure links to the "4 polishing + 1 smoothing" steps. Revise captions to specify these correspondences, following the figure standards of relevant journals (e.g., Photonics as referenced in the "Comments..docx"). 2. Inconsistent Reference FormattingSome Chinese references (e.g., [17], [18]) lack authors’ Pinyin and journal indexing information (e.g., "Chinese Core Journals"). English reference [22] (Fang F Z et al.) is missing complete volume and page details. Supplement all missing information and standardize formatting for both Chinese and English references. 3. Ununiform Key Term Usage"Nanoscale precision shape and property control" is inconsistently abbreviated: "nanoscale shape and property control" (abstract) and "shape control" (Section 4.1). "Subsurface damage" occasionally uses the non-standard variant "subsurface impairment". Standardize terms: use full English names for key terms on first appearance and maintain consistency throughout. 4. Insufficient Experimental Statistical DataSection 2.1 (Chen Xiao’s result: 0.52 μm PV value for surface shape accuracy) and Section 3.1 (78% reduction in subsurface dangling bond defects via ion beam processing) lack critical details: number of experimental repetitions, standard deviation, and sample size. Add such data (e.g., "PV=0.52±0.03 μm, n=3") to enhance result credibility and reproducibility. 5. Incomplete Figure Caption InformationFigure 3’s caption ("Φ100 mm × 5 mm monocrystalline silicon mirrors") does not define "Φ100 mm" (diameter) and "5 mm" (thickness). Figure 7 omits units for "etching beam current density" (e.g., μA/cm²). Supplement these details in captions—no modifications to the figures themselves are needed. It is recommended that the manuscript be accepted for publication after minor revisions. The authors are requested to address all the above points to improve the manuscript’s rigor and clarity.

Author Response

Author Response File: Author Response.pdf

Reviewer 3 Report

Comments and Suggestions for Authors

Monocrystalline silicon is a single-crystal silicon material with a continuous, unbroken crystal lattice, most notably used in high-performance solar cells. It is known for its high energy conversion efficiency (15–24%) due to its pure, uniform structure, but it is also more expensive to produce than polycrystalline silicon. In terms of the breath or the depth of the topic there is a little deficiency. The precision manufacturing is important for any material, then what is special for single crystalline silicone? This should be addressed.

PV value has been mentioned a few times. However, there is no definition of it.
The methodology in ref.23 is not clearly introduced. It’s essential that the whole technology is elucidated not just the results. It is a general term “Precision Shape and Property Control Manufacturing” and applicable to many materials in many fashions. Another example is the laser-assisted adaptive fly-cutting. As in Plasma Etching for Defect Removal section at least a brief description is better.
The sentences all not separated by space.
The phases “With the rapid advancement of….” Are used to many times. Please use some other statements of substantial industrial sector figures.
The language has to be examined and the format of bibliography is flawed.
If possible, with limited researches sited, more details of each area can be expounded.

Comments on the Quality of English Language

The English and style has to be much improved.

Author Response

Author Response File: Author Response.pdf