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Journal: Processes, 2023
Volume: 11
Number: 2880
Article:
Dynamic and Thermal Buckling Behaviors of Multi-Span Honeycomb Sandwich Panel with Arbitrary Boundaries
Authors:
by
Min Wang, Junfu Gao, Lun Liu, Lixia Liu, Shupeng Sun and Leilei Zeng
Link:
https://www.mdpi.com/2227-9717/11/10/2880
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