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Journal: Processes, 2023
Volume: 11
Number: 2880

Article: Dynamic and Thermal Buckling Behaviors of Multi-Span Honeycomb Sandwich Panel with Arbitrary Boundaries
Authors: by Min Wang, Junfu Gao, Lun Liu, Lixia Liu, Shupeng Sun and Leilei Zeng
Link: https://www.mdpi.com/2227-9717/11/10/2880

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