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Journal: Electronics, 2025
Volume: 14
Number: 1670
Article:
Package Integration and System Performance Analysis of Glass-Based Passive Components for 5G New Radio Millimeter-Wave Modules
Authors:
by
Muhammad Ali, Atom Watanabe, Takenori Kakutani, Pulugurtha M. Raj, Rao. R. Tummala and Madhavan Swaminathan
Link:
https://www.mdpi.com/2079-9292/14/8/1670
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