Li, Y.; Fu, P.; Gu, H.; Liang, S.; Li, L.; Jiang, H.; Hong, Y.; Li, Z.; Lu, L.; Tang, R.;
et al. Atomic-Scale Mechanisms and Damage Suppression in Nanometric Cutting of Polycrystalline Copper: A Molecular Dynamics Study. Nanomaterials 2026, 16, 564.
https://doi.org/10.3390/nano16090564
AMA Style
Li Y, Fu P, Gu H, Liang S, Li L, Jiang H, Hong Y, Li Z, Lu L, Tang R,
et al. Atomic-Scale Mechanisms and Damage Suppression in Nanometric Cutting of Polycrystalline Copper: A Molecular Dynamics Study. Nanomaterials. 2026; 16(9):564.
https://doi.org/10.3390/nano16090564
Chicago/Turabian Style
Li, Yang, Peng Fu, Huan Gu, Shulin Liang, Lin Li, Hao Jiang, Yuan Hong, Zhan Li, Lei Lu, Rongrong Tang,
and et al. 2026. "Atomic-Scale Mechanisms and Damage Suppression in Nanometric Cutting of Polycrystalline Copper: A Molecular Dynamics Study" Nanomaterials 16, no. 9: 564.
https://doi.org/10.3390/nano16090564
APA Style
Li, Y., Fu, P., Gu, H., Liang, S., Li, L., Jiang, H., Hong, Y., Li, Z., Lu, L., Tang, R., Li, Z., & Li, L.
(2026). Atomic-Scale Mechanisms and Damage Suppression in Nanometric Cutting of Polycrystalline Copper: A Molecular Dynamics Study. Nanomaterials, 16(9), 564.
https://doi.org/10.3390/nano16090564
