Article Versions Notes

Lai J-Y, Tran D-P, Yang S-C, Tseng I-H, Shie K-C, Leu J, Chen C. Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials. 2023; 13(4):709. https://doi.org/10.3390/nano13040709

Lai, Jyun-Yu, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, and Chih Chen. 2023. "Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing" Nanomaterials 13, no. 4: 709. https://doi.org/10.3390/nano13040709

Lai, J.-Y., Tran, D.-P., Yang, S.-C., Tseng, I.-H., Shie, K.-C., Leu, J., & Chen, C. (2023). Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials, 13(4), 709. https://doi.org/10.3390/nano13040709