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Journal: Appl. Sci., 2021
Volume: 11
Number: 1507

Article: Analysis of Correlation between Pad Temperature and Asperity Angle in Chemical Mechanical Planarization
Authors: by Seonho Jeong, Kyeongwoo Jeong, Jinuk Choi and Haedo Jeong
Link: https://www.mdpi.com/2076-3417/11/4/1507

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