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Journal: Appl. Sci., 2021
Volume: 11
Number: 8536
Article:
High Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components
Authors:
by
Ping Guo, Hongling Meng, Lin Dan, Hao Xu and Jianye Zhao
Link:
https://www.mdpi.com/2076-3417/11/18/8536
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