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Journal: Appl. Sci., 2021
Volume: 11
Number: 8403
8403
Article: Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper
Authors: by Lorenzo Fabbri, Walter Giurlani, Fabio Biffoli, Marco Bellini, Hamish Miller, Claudio Fontanesi, Francesco Vizza and Massimo Innocenti
Link: https://www.mdpi.com/2076-3417/11/18/8403

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