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Journal: Applied SciencesVolume: 11Number: 8403
Article: Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper
  • Authors:
  • Lorenzo Fabbri1,†,
  • Walter Giurlani1,2,*,† and
  • Massimo Innocenti1,2,3,5,*
  • et al.
Link: https://www.mdpi.com/2076-3417/11/18/8403

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