Review Reports

Round 1

Reviewer 1 Report

This paper describes the three types of NDT technology including X-ray, SAM and TTA and evaluated their applicability for the three most common interconnect technologies including reflow soldering, sintering and adhesive interconnects. The results are sound and the paper is well written. I don't have specific comment and I suggest to publish this paper. 

Author Response

Dear Reviewer,

 

 

Thank you for reviewing my paper and suggesting a publication.

 

We did a final spell check and fixed typing errors.

 

 

Kind regards,

Maximilian Schmid

Reviewer 2 Report

The article brings a very good comparison of three nondestructive testing methods at three different types of interconnect technology. The article is a very good contribution as a practical overview although it's novelty is lower. 

The artcile contains several typing errors eg.:

pick "a" place machine, see line 94

See word pasts in sentence (line 450): „In that way the three "pasts" can be benchmarked to the SAC305 sample.“

Author Response

Dear Reviewer,

 

 

Thank you for reviewing my paper and suggesting a publication.

 

We did a final spell check and fixed typing errors.

 

 

Kind regards,

Maximilian Schmid