Hauf, U.; Kauffmann, A.; Kauffmann-Weiss, S.; Feilbach, A.; Boening, M.; Mueller, F.E.H.; Hinrichsen, V.; Heilmaier, M.
Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification. Metals 2017, 7, 478.
https://doi.org/10.3390/met7110478
AMA Style
Hauf U, Kauffmann A, Kauffmann-Weiss S, Feilbach A, Boening M, Mueller FEH, Hinrichsen V, Heilmaier M.
Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification. Metals. 2017; 7(11):478.
https://doi.org/10.3390/met7110478
Chicago/Turabian Style
Hauf, Ulla, Alexander Kauffmann, Sandra Kauffmann-Weiss, Alexander Feilbach, Mike Boening, Frank E. H. Mueller, Volker Hinrichsen, and Martin Heilmaier.
2017. "Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification" Metals 7, no. 11: 478.
https://doi.org/10.3390/met7110478
APA Style
Hauf, U., Kauffmann, A., Kauffmann-Weiss, S., Feilbach, A., Boening, M., Mueller, F. E. H., Hinrichsen, V., & Heilmaier, M.
(2017). Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification. Metals, 7(11), 478.
https://doi.org/10.3390/met7110478