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Journal: Micromachines, 2022
Volume: 13
Number: 166

Article: Modeling and Measurement of Thermal–Mechanical-Stress-Creep Effect for RF MEMS Switch Up to 200 °C
Authors: by Yulong Zhang, Jianwen Sun, Huiliang Liu and Zewen Liu
Link: https://www.mdpi.com/2072-666X/13/2/166

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