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Journal: Materials, 2025
Volume: 18
Number: 857
857
Article: Enhanced Thermal Conductivity and Dielectric Performance of CMZBS–Glass–Ceramic Composites with AlN Whisker Incorporation for LTCC Applications
Authors: by Tiange Xue, Xinqing Su, Shixiang Yu, Meng Meng, Xinya Xu, Jinqi Xin and Jinjin Ran
Link: https://www.mdpi.com/1996-1944/18/4/857

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