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Journal: Materials, 2023
Volume: 16
Number: 6318

Article: Thermal Conductivity and Microstructure of Novel Flaxseed-Gum-Filled Epoxy Resin Biocomposite: Analytical Models and X-ray Computed Tomography
Authors: by Mohammed Zaidi, Dominique Baillis, Naim Naouar, Michael Depriester and François Delattre
Link: https://www.mdpi.com/1996-1944/16/18/6318

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