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Editorial

Special Issue: Thermal Analysis of Materials

1
School of Molecular Sciences and Center for Materials of the Universe, Arizona State University, Tempe, AZ 85287, USA
2
Department of Materials Engineering at the Ben-Gurion University of the Negev, Beer-Sheva 84105, Israel
*
Authors to whom correspondence should be addressed.
Materials 2021, 14(17), 4923; https://doi.org/10.3390/ma14174923
Submission received: 12 August 2021 / Accepted: 27 August 2021 / Published: 30 August 2021
(This article belongs to the Special Issue Thermal Analysis of Materials)

Excerpt

Note: In lieu of an abstract, this is an excerpt from the first page.

The measurement of any physical property as a function of temperature brings the method used into the realm of thermal analysis [...]

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MDPI and ACS Style

Ushakov, S.V.; Hayun, S. Special Issue: Thermal Analysis of Materials. Materials 2021, 14, 4923. https://doi.org/10.3390/ma14174923

AMA Style

Ushakov SV, Hayun S. Special Issue: Thermal Analysis of Materials. Materials. 2021; 14(17):4923. https://doi.org/10.3390/ma14174923

Chicago/Turabian Style

Ushakov, Sergey V., and Shmuel Hayun. 2021. "Special Issue: Thermal Analysis of Materials" Materials 14, no. 17: 4923. https://doi.org/10.3390/ma14174923

APA Style

Ushakov, S. V., & Hayun, S. (2021). Special Issue: Thermal Analysis of Materials. Materials, 14(17), 4923. https://doi.org/10.3390/ma14174923

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