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Journal: Materials, 2021
Volume: 14
Number: 3285
Article:
Cu Patterning Using Femtosecond Laser Reductive Sintering of CuO Nanoparticles under Inert Gas Injection
Authors:
by
Mizue Mizoshiri and Kyohei Yoshidomi
Link:
https://www.mdpi.com/1996-1944/14/12/3285
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