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Journal: Materials, 2021
Volume: 14
Number: 3285

Article: Cu Patterning Using Femtosecond Laser Reductive Sintering of CuO Nanoparticles under Inert Gas Injection
Authors: by Mizue Mizoshiri and Kyohei Yoshidomi
Link: https://www.mdpi.com/1996-1944/14/12/3285

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