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Keywords = Schottky emission

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14 pages, 2646 KiB  
Article
Analog Resistive Switching Phenomena in Titanium Oxide Thin-Film Memristive Devices
by Karimul Islam, Rezwana Sultana and Robert Mroczyński
Materials 2025, 18(15), 3454; https://doi.org/10.3390/ma18153454 - 23 Jul 2025
Viewed by 367
Abstract
Memristors with resistive switching capabilities are vital for information storage and brain-inspired computing, making them a key focus in current research. This study demonstrates non-volatile analog resistive switching behavior in Al/TiOx/TiN/Si(n++)/Al memristive devices. Analog resistive switching offers gradual, controllable [...] Read more.
Memristors with resistive switching capabilities are vital for information storage and brain-inspired computing, making them a key focus in current research. This study demonstrates non-volatile analog resistive switching behavior in Al/TiOx/TiN/Si(n++)/Al memristive devices. Analog resistive switching offers gradual, controllable conductance changes, which are essential for mimicking brain-like synaptic behavior, unlike digital/abrupt switching. The amorphous titanium oxide (TiOx) active layer was deposited using the pulsed-DC reactive magnetron sputtering technique. The impact of increasing the oxide thickness on the electrical performance of the memristors was investigated. Electrical characterizations revealed stable, forming-free analog resistive switching, achieving endurance beyond 300 DC cycles. The charge conduction mechanisms underlying the current–voltage (I–V) characteristics are analyzed in detail, revealing the presence of ohmic behavior, Schottky emission, and space-charge-limited conduction (SCLC). Experimental results indicate that increasing the TiOx film thickness from 31 to 44 nm leads to a notable change in the current conduction mechanism. The results confirm that the memristors have good stability (>1500 s) and are capable of exhibiting excellent long-term potentiation (LTP) and long-term depression (LTD) properties. The analog switching driven by oxygen vacancy-induced barrier modulation in the TiOx/TiN interface is explained in detail, supported by a proposed model. The remarkable switching characteristics exhibited by the TiOx-based memristive devices make them highly suitable for artificial synapse applications in neuromorphic computing systems. Full article
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13 pages, 2272 KiB  
Article
Zn2GeO4@CeO2 Core@Shell Nanorods for Efficient Photocatalytic CO2 Reduction
by Jin Sun, Yunxia Bai, Xilan Feng, Dapeng Liu and Yu Zhang
Molecules 2025, 30(10), 2205; https://doi.org/10.3390/molecules30102205 - 18 May 2025
Viewed by 467
Abstract
The enduring problem of CO2 emissions and their consequent influence on the earth’s atmosphere has captured the attention of researchers. Photocatalytic CO2 reduction holds great significance; however, it is constrained by the effect of carrier recombination. Simultaneously, the structural modification of [...] Read more.
The enduring problem of CO2 emissions and their consequent influence on the earth’s atmosphere has captured the attention of researchers. Photocatalytic CO2 reduction holds great significance; however, it is constrained by the effect of carrier recombination. Simultaneously, the structural modification of heterojunction catalysts has emerged as a promising approach to boost the photocatalytic performance. Herein, Zn2GeO4@CeO2 core@shell nanorods were prepared by a simple self-assembly method for photocatalytic CO2 reduction. The thickness of the CeO2 shell can be regulated rapidly and conveniently. The photocatalytic results indicate that the structure regulation could affect the photocatalytic performance by controlling the amount of active sites and the shielding effect. X-ray photoelectron spectroscopy (XPS) and Mott–Schottky analyses reveal that Zn2GeO4 and CeO2 formed Type-I heterojunctions, which prolonged the lifetime of the photogenerated carriers. The CO2 adsorption and activation capacities of CeO2 also exert a beneficial influence on the progress of CO2 photoreduction, thus enabling efficient photocatalytic CO2 reduction. Moreover, the in situ FT-IR spectra show that Zn2GeO4@CeO2 suppresses the formation of byproduct intermediates and shows higher CO selectivity. The best sample of Zn2GeO4@0.07CeO2 can exhibit a CO yield of as high as 1190.9 μmol g−1 h−1. Full article
(This article belongs to the Section Materials Chemistry)
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15 pages, 3554 KiB  
Article
Study of ZrO2 Gate Dielectric with Thin SiO2 Interfacial Layer in 4H-SiC Trench MOS Capacitors
by Qimin Huang, Yunduo Guo, Anfeng Wang, Zhaopeng Bai, Lin Gu, Zhenyu Wang, Chengxi Ding, Yi Shen, Hongping Ma and Qingchun Zhang
Materials 2025, 18(8), 1741; https://doi.org/10.3390/ma18081741 - 10 Apr 2025
Viewed by 682
Abstract
The transition of SiC MOSFET structure from planar to trench-based architectures requires the optimization of gate dielectric layers to improve device performance. This study utilizes a range of characterization techniques to explore the interfacial properties of ZrO2 and SiO2/ZrO2 [...] Read more.
The transition of SiC MOSFET structure from planar to trench-based architectures requires the optimization of gate dielectric layers to improve device performance. This study utilizes a range of characterization techniques to explore the interfacial properties of ZrO2 and SiO2/ZrO2 gate dielectric films, grown via atomic layer deposition (ALD) in SiC epitaxial trench structures to assess their performance and suitability for device applications. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) measurements showed the deposition of smooth film morphologies with roughness below 1 nm for both ZrO2 and SiO2/ZrO2 gate dielectrics, while SE measurements revealed comparable physical thicknesses of 40.73 nm for ZrO2 and 41.55 nm for SiO2/ZrO2. X-ray photoelectron spectroscopy (XPS) shows that in SiO2/ZrO2 thin films, the binding energies of Zr 3d5/2 and Zr 3d3/2 peaks shift upward compared to pure ZrO2. Electrical characterization showed an enhancement of EBR (3.76 to 5.78 MV·cm−1) and a decrease of ION_EBR (1.94 to 2.09 × 10−3 A·cm−2) for the SiO2/ZrO2 stacks. Conduction mechanism analysis identified suppressed Schottky emission in the stacked film. This indicates that the incorporation of a thin SiO2 layer effectively mitigates the small bandgap offset, enhances the breakdown electric field, reduces leakage current, and improves device performance. Full article
(This article belongs to the Special Issue Feature Papers in Materials Physics (2nd Edition))
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11 pages, 3973 KiB  
Article
Impact of Processing Parameters on Ti Schottky Contacts on 4H-SiC
by Marilena Vivona, Gabriele Bellocchi, Valeria Puglisi, Corrado Bongiorno, Salvatore Adamo, Filippo Giannazzo, Simone Rascunà and Fabrizio Roccaforte
Materials 2025, 18(7), 1447; https://doi.org/10.3390/ma18071447 - 25 Mar 2025
Viewed by 588
Abstract
In this paper, we investigated the effects of the processing parameters, such as deposition methods, annealing temperature, and metal thickness, on the electrical characteristics of Ti/4H-SiC contacts. A reduction of the Schottky barrier height from 1.19 to 1.00 eV following an increase of [...] Read more.
In this paper, we investigated the effects of the processing parameters, such as deposition methods, annealing temperature, and metal thickness, on the electrical characteristics of Ti/4H-SiC contacts. A reduction of the Schottky barrier height from 1.19 to 1.00 eV following an increase of the annealing temperature (475–700 °C) was observed for a reference contact with an 80 nm-thick Ti layer. The current transport mechanisms can be described according to the thermionic emission (TE) and thermionic field emission (TFE) models under forward and reverse biases, respectively. The comparison with an e-beam evaporated Ti(80 nm)/4H-SiC contact did not show significant differences for the forward characteristics, while an increase of the leakage current was observed under high reverse voltage (>500 V). Finally, a thickness variation from 10 to 80 nm induced a reduction of the Schottky barrier height, due to the reaction occurring at the interface with a Ti-Al region extended up to the 4H-SiC surface. In addition to a deeper understanding of the Schottky barrier properties, this work is useful for the development of Schottky barrier diodes with tailored characteristics. Full article
(This article belongs to the Section Electronic Materials)
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11 pages, 2286 KiB  
Article
The Barrier Inhomogeneity and the Electrical Characteristics of W/Au β-Ga2O3 Schottky Barrier Diodes
by Lei Xie, Tao Zhang, Shengrui Xu, Huake Su, Hongchang Tao, Yuan Gao, Xu Liu, Jincheng Zhang and Yue Hao
Micromachines 2025, 16(4), 369; https://doi.org/10.3390/mi16040369 - 25 Mar 2025
Viewed by 597
Abstract
In this work, the electrical properties of the Ga2O3 Schottky barrier diodes (SBDs) using W/Au as the Schottky metal were investigated. Due to the 450 °C post-anode annealing (PAA), the reduced oxygen vacancy defects on the β-Ga2O [...] Read more.
In this work, the electrical properties of the Ga2O3 Schottky barrier diodes (SBDs) using W/Au as the Schottky metal were investigated. Due to the 450 °C post-anode annealing (PAA), the reduced oxygen vacancy defects on the β-Ga2O3 surface resulted in the improvement in the forward characteristics of the W/Au Ga2O3 Schottky diode, and the breakdown voltage was significantly enhanced, increasing by 56.25% from 400 V to 625 V after PAA treatment. Additionally, the temperature dependence of barrier heights and ideality factors was analyzed using the thermionic emission (TE) model combined with a Gaussian distribution of barrier heights. Post-annealing reduced the apparent barrier height standard deviation from 112 meV to 92 meV, indicating a decrease in barrier height fluctuations. And the modified Richardson constants calculated for the as-deposited and annealed samples were in close agreement with the theoretical value, demonstrating that the barrier inhomogeneity of the W/Au Ga2O3 SBDs can be accurately explained using the TE model with a Gaussian distribution of barrier heights. Full article
(This article belongs to the Section D1: Semiconductor Devices)
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14 pages, 3518 KiB  
Article
On the Current Conduction and Interface Passivation of Graphene–Insulator–Silicon Solar Cells
by Hei Wong, Jieqiong Zhang, Jun Liu and Muhammad Abid Anwar
Nanomaterials 2025, 15(6), 416; https://doi.org/10.3390/nano15060416 - 8 Mar 2025
Viewed by 853
Abstract
Interface-passivated graphene/silicon Schottky junction solar cells have demonstrated promising features with improved stability and power conversion efficiency (PCE). However, there are some misunderstandings in the literature regarding some of the working mechanisms and the impacts of the silicon/insulator interface. Specifically, attributing performance improvement [...] Read more.
Interface-passivated graphene/silicon Schottky junction solar cells have demonstrated promising features with improved stability and power conversion efficiency (PCE). However, there are some misunderstandings in the literature regarding some of the working mechanisms and the impacts of the silicon/insulator interface. Specifically, attributing performance improvement to oxygen vacancies and characterizing performance using Schottky barrier height and ideality factor might not be the most accurate or appropriate. This work uses Al2O3 as an example to provide a detailed discussion on the interface ALD growth of Al2O3 on silicon and its impact on graphene electrode metal–insulator–semiconductor (MIS) solar cells. We further suggest that the current conduction in MIS solar cells with an insulating layer of 2 to 3 nm thickness is better described by direct tunneling, Poole–Frenkel emission, and Fowler–Nordheim tunneling, as the junction voltage sweeps from negative to a larger forward bias. The dielectric film thickness, its band offset with Si, and the interface roughness, are key factors to consider for process optimization. Full article
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11 pages, 2521 KiB  
Article
Threshold Voltage Recovery Time Measurement Technique Post VTH Instability in Normally-Off p-Gate GaN High Electron Mobility Transistors
by Karthick Murukesan and Florin Udrea
Electronics 2024, 13(20), 4118; https://doi.org/10.3390/electronics13204118 - 18 Oct 2024
Viewed by 1894
Abstract
In this study, we propose a simple measurement technique to quantitatively measure the time taken by threshold voltage of normally-off p-GaN AlGaN/GaN HEMTs to recover from a nominal operational gate stress-induced instability. The proposed technique eliminates the requirement to perform a full transfer [...] Read more.
In this study, we propose a simple measurement technique to quantitatively measure the time taken by threshold voltage of normally-off p-GaN AlGaN/GaN HEMTs to recover from a nominal operational gate stress-induced instability. The proposed technique eliminates the requirement to perform a full transfer characteristic sweep post-stress, thereby eliminating the measurement-induced instability effect, often colluding precise recovery time measurement. The rate of recovery and extracted recovery times hold significance in empirically correlating the location of traps in the p-GaN or AlGaN barrier region causing VTH instability. The gate of the HEMT is stressed at nominal operational drive voltages 1.5 V, 2 V, and 4 V for various time intervals from 500 μs to 100 s, and the time taken for the drain current to recover to prestress levels measured at near-threshold voltage (~1.1 VTH) is measured as the threshold voltage recovery time. With increasing gate stress voltages, 2DEG gets trapped at relatively deeper trap energy levels at the AlGaN/GaN interface requiring more emission time during the process of recovery, mandating larger recovery times. At higher stress voltage of 4 V, the Schottky gate leakage current is high enough enabling injected holes to cross the AlGaN barrier and counter-compensate for the deeply trapped 2DEG, requiring relatively the same recovery times as lower stress voltages where the gate leakage is negligibly small. With increasing stress time, the amount of 2DEG trapped increases, requiring more recovery time to de-trap and beyond a certain time, saturation of the trap density occurs causing the recovery time to plateau. Full article
(This article belongs to the Special Issue Research and Application of Wide Band Gap Semiconductors)
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18 pages, 7524 KiB  
Article
Electric Field Features and Charge Behavior in Oil-Pressboard Composite Insulation under Impulse Voltage
by Jun Deng, Chunjia Gao, Zhicheng Xie, Hao Ge, Haibin Zhou, Xiaolin Zhao, Zhicheng Pan and Bo Qi
Energies 2024, 17(19), 4903; https://doi.org/10.3390/en17194903 - 30 Sep 2024
Viewed by 925
Abstract
Oil-pressboard/paper insulation materials are essential in transformers for ensuring their safe and stable operation, primarily due to their roles in spatial electric field distribution and charge migration mechanisms. Current spatial distribution analyses rely on computational methods that lack empirical validation, particularly for oil-pressboard/paper [...] Read more.
Oil-pressboard/paper insulation materials are essential in transformers for ensuring their safe and stable operation, primarily due to their roles in spatial electric field distribution and charge migration mechanisms. Current spatial distribution analyses rely on computational methods that lack empirical validation, particularly for oil-pressboard/paper composites. This study leverages the principles of the Kerr electro-optic effect to develop a rapid measurement platform for electric fields within oil-pressboard/paper insulation under impulse voltage conditions, which measures the spatial electric field characteristics using Cu-Cu and Al-Al electrodes under various scenarios: with asymmetric and symmetric pressboard coverage and different numbers of insulating paper layers. Findings indicated: (1) In asymmetric pressboard models, Cu-Cu electrodes exhibit a consistent peak electric field of approximately 16 kV/mm, while Al-Al electrodes show peak values of 18.13 kV/mm and −14.98 kV/mm. Charge density patterns are similar, with Cu-Cu at about 68 μC/m2 and Al-Al at 11.2 μC/m2 and −124.8 μC/m2. (2) Symmetric models present consistent peak electric fields and charge densities for both polarities. (3) Increasing insulating paper layers elevates electric field strengths. Both electrodes show the similar peak field of about 17 kV/mm with differing paper layers due to higher charge injection from the Al electrode. (4) Utilizing the Schottky effect and field emission principles, the study clarifies charge generation and migration mechanisms. These insights could provide a theoretical foundation for designing and verifying oil-pressboard/paper insulation structures in transformers. Full article
(This article belongs to the Section F6: High Voltage)
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13 pages, 10058 KiB  
Article
Hot Electrons Induced by Localized Surface Plasmon Resonance in Ag/g-C3N4 Schottky Junction for Photothermal Catalytic CO2 Reduction
by Peng Jiang, Kun Wang, Wenrui Liu, Yuhang Song, Runtian Zheng, Lihua Chen and Baolian Su
Polymers 2024, 16(16), 2317; https://doi.org/10.3390/polym16162317 - 16 Aug 2024
Cited by 6 | Viewed by 1919
Abstract
Converting carbon dioxide (CO2) into high-value-added chemicals using solar energy is a promising approach to reducing carbon dioxide emissions; however, single photocatalysts suffer from quick the recombination of photogenerated electron–hole pairs and poor photoredox ability. Herein, silver (Ag) nanoparticles featuring with [...] Read more.
Converting carbon dioxide (CO2) into high-value-added chemicals using solar energy is a promising approach to reducing carbon dioxide emissions; however, single photocatalysts suffer from quick the recombination of photogenerated electron–hole pairs and poor photoredox ability. Herein, silver (Ag) nanoparticles featuring with localized surface plasmon resonance (LSPR) are combined with g-C3N4 to form a Schottky junction for photothermal catalytic CO2 reduction. The Ag/g-C3N4 exhibits higher photocatalytic CO2 reduction activity under UV-vis light; the CH4 and CO evolution rates are 10.44 and 88.79 µmol·h−1·g−1, respectively. Enhanced photocatalytic CO2 reduction performances are attributed to efficient hot electron transfer in the Ag/g-C3N4 Schottky junction. LSPR-induced hot electrons from Ag nanoparticles improve the local reaction temperature and promote the separation and transfer of photogenerated electron–hole pairs. The charge carrier transfer route was investigated by in situ irradiated X-ray photoelectron spectroscopy (XPS). The three-dimensional finite-difference time-domain (3D-FDTD) method verified the strong electromagnetic field at the interface between Ag and g-C3N4. The photothermal catalytic CO2 reduction pathway of Ag/g-C3N4 was investigated using in situ diffuse reflectance infrared Fourier transform spectra (DRIFTS). This study examines hot electron transfer in the Ag/g-C3N4 Schottky junction and provides a feasible way to design a plasmonic metal/polymer semiconductor Schottky junction for photothermal catalytic CO2 reduction. Full article
(This article belongs to the Special Issue Advances in Photoelectric Functional Polymer Materials)
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13 pages, 3971 KiB  
Article
Charge Trapping and Emission during Bias Temperature Stressing of Schottky Gate GaN-on-Silicon HEMT Structures Targeting RF/mm Wave Power Amplifiers
by Barry O’Sullivan, Aarti Rathi, Alireza Alian, Sachin Yadav, Hao Yu, Arturo Sibaja-Hernandez, Uthayasankaran Peralagu, Bertrand Parvais, Adrian Chasin and Nadine Collaert
Micromachines 2024, 15(8), 951; https://doi.org/10.3390/mi15080951 - 24 Jul 2024
Cited by 1 | Viewed by 1180
Abstract
For operation as power amplifiers in RF applications, high electron mobility transistor (HEMT) structures are subjected to a range of bias conditions, applied at both the gate and drain terminals, as the device is biased from the OFF- to ON-state conditions. The stability [...] Read more.
For operation as power amplifiers in RF applications, high electron mobility transistor (HEMT) structures are subjected to a range of bias conditions, applied at both the gate and drain terminals, as the device is biased from the OFF- to ON-state conditions. The stability of the device threshold voltage (Vt) condition is imperative from a circuit-design perspective and is the focus of this study, where stresses in both the ON and OFF states are explored. We see rapid positive threshold voltage increases under negative bias stress and subsequent recovery (i.e., Vt reduces), whereas conversely, we see a negative Vt shift under positive stress and Vt increase during the subsequent relaxation phase. These effects are correlated with the thickness of the GaN layer and ultimately result from the deep carbon-acceptor levels in the C-GaN back barrier incorporated to screen the buffer between the silicon substrate and the epitaxially grown GaN layer. Methods to mitigate this effect are explored, and the consequences are discussed. Full article
(This article belongs to the Special Issue Reliability Issues in Advanced Transistor Nodes, Second Edition)
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11 pages, 7619 KiB  
Article
On the Asymmetry of Resistive Switching Transitions
by Guillermo Vinuesa, Héctor García, Eduardo Pérez, Christian Wenger, Ignacio Íñiguez-de-la-Torre, Tomás González, Salvador Dueñas and Helena Castán
Electronics 2024, 13(13), 2639; https://doi.org/10.3390/electronics13132639 - 5 Jul 2024
Cited by 1 | Viewed by 1321
Abstract
In this study, the resistive switching phenomena in TiN/Ti/HfO2/Ti metal–insulator–metal stacks is investigated, mainly focusing on the analysis of set and reset transitions. The electrical measurements in a wide temperature range reveal that the switching transitions require less voltage (and thus, [...] Read more.
In this study, the resistive switching phenomena in TiN/Ti/HfO2/Ti metal–insulator–metal stacks is investigated, mainly focusing on the analysis of set and reset transitions. The electrical measurements in a wide temperature range reveal that the switching transitions require less voltage (and thus, less energy) as temperature rises, with the reset process being much more temperature sensitive. The main conduction mechanism in both resistance states is Space-charge-limited Conduction, but the high conductivity state also shows Schottky emission, explaining its temperature dependence. Moreover, the temporal evolution of these transitions reveals clear differences between them, as their current transient response is completely different. While the set is sudden, the reset process development is clearly non-linear, closely resembling a sigmoid function. This asymmetry between switching processes is of extreme importance in the manipulation and control of the multi-level characteristics and has clear implications in the possible applications of resistive switching devices in neuromorphic computing. Full article
(This article belongs to the Special Issue Random Access Memory (RAM): Circuits and Applications)
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13 pages, 5877 KiB  
Article
Study of Leakage Current Transport Mechanisms in Pseudo-Vertical GaN-on-Silicon Schottky Diode Grown by Localized Epitaxy
by Mohammed El Amrani, Julien Buckley, Thomas Kaltsounis, David Plaza Arguello, Hala El Rammouz, Daniel Alquier and Matthew Charles
Crystals 2024, 14(6), 553; https://doi.org/10.3390/cryst14060553 - 14 Jun 2024
Cited by 3 | Viewed by 1845
Abstract
In this work, a GaN-on-Si quasi-vertical Schottky diode was demonstrated on a locally grown n-GaN drift layer using Selective Area Growth (SAG). The diode achieved a current density of 2.5 kA/cm2, a specific on-resistance RON,sp of [...] Read more.
In this work, a GaN-on-Si quasi-vertical Schottky diode was demonstrated on a locally grown n-GaN drift layer using Selective Area Growth (SAG). The diode achieved a current density of 2.5 kA/cm2, a specific on-resistance RON,sp of 1.9 mΩ cm2 despite the current crowding effect in quasi-vertical structures, and an on/off current ratio (Ion/Ioff) of 1010. Temperature-dependent current–voltage characteristics were measured in the range of 313–433 K to investigate the mechanisms of leakage conduction in the device. At near-zero bias, thermionic emission (TE) was found to dominate. By increasing up to 10 V, electrons gained enough energy to excite into trap states, leading to the dominance of Frenkel–Poole emission (FPE). For a higher voltage range (−10 V to −40 V), the increased electric field facilitated the hopping of electrons along the continuum threading dislocations in the “bulk” GaN layers, and thus, variable range hopping became the main mechanism for the whole temperature range. This work provides an in-depth insight into the leakage conduction transport on pseudo-vertical GaN-on-Si Schottky barrier diodes (SBDs) grown by localized epitaxy. Full article
(This article belongs to the Special Issue Wide Bandgap Semiconductor: GaN and SiC Material and Device)
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14 pages, 2563 KiB  
Article
Comparative Study on Schottky Contact Behaviors between Ga- and N-Polar GaN with SiNx Interlayer
by Zhehan Yu, Yijun Dai, Ke Tang, Tian Luo, Shengli Qi, Smriti Singh, Lu Huang, Jichun Ye, Biplab Sarkar and Wei Guo
Electronics 2024, 13(9), 1679; https://doi.org/10.3390/electronics13091679 - 26 Apr 2024
Cited by 2 | Viewed by 2001
Abstract
We conducted a comparative study on the characterization of Ga-polar and N-polar GaN metal–insulator–semiconductor (MIS) Schottky contact with a SiNx gate dielectric. The correlation between the surface morphology and the current–voltage (I–V) characteristics of the Ga- and N-polar GaN Schottky contact with [...] Read more.
We conducted a comparative study on the characterization of Ga-polar and N-polar GaN metal–insulator–semiconductor (MIS) Schottky contact with a SiNx gate dielectric. The correlation between the surface morphology and the current–voltage (I–V) characteristics of the Ga- and N-polar GaN Schottky contact with and without SiNx was established. The insertion of SiNx helps in reducing the reverse leakage current for both structures, even though the leakage is still higher for N-polar GaN, consistent with the Schottky barrier height calculated using X-ray photoelectron spectroscopy. To optimize the electric property of the N-polar device, various substrate misorientation angles were adopted. Among the different misorientation angles of the sapphire substrate, the GaN MIS Schottky barrier diode grown on 1° sapphire shows the lowest reverse leakage current, the smoothest surface morphology, and the best crystalline quality compared to N-polar GaN grown on 0.2° and 2° sapphire substrates. Furthermore, the mechanism of the reverse leakage current of the MIS-type N-polar GaN Schottky contact was investigated by temperature-dependent I–V characterization. FP emissions are thought to be the dominant reverse conduction mechanism for the N-polar GaN MIS diode. This work provides a promising approach towards the optimization of N-polar electronic devices with low levels of leakage and a favorable ideality factor. Full article
(This article belongs to the Special Issue Wide and Ultrawide Band Gap Semiconductors: Materials and Devices)
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17 pages, 4865 KiB  
Article
High-Performance Memristive Synapse Composed of Ferroelectric ZnVO-Based Schottky Junction
by Youngmin Lee, Chulwoong Hong, Sankar Sekar and Sejoon Lee
Nanomaterials 2024, 14(6), 506; https://doi.org/10.3390/nano14060506 - 11 Mar 2024
Cited by 4 | Viewed by 1941
Abstract
In pursuit of realizing neuromorphic computing devices, we demonstrated the high-performance synaptic functions on the top-to-bottom Au/ZnVO/Pt two-terminal ferroelectric Schottky junction (FSJ) device architecture. The active layer of ZnVO exhibited the ferroelectric characteristics because of the broken lattice-translational symmetry, arising from the incorporation [...] Read more.
In pursuit of realizing neuromorphic computing devices, we demonstrated the high-performance synaptic functions on the top-to-bottom Au/ZnVO/Pt two-terminal ferroelectric Schottky junction (FSJ) device architecture. The active layer of ZnVO exhibited the ferroelectric characteristics because of the broken lattice-translational symmetry, arising from the incorporation of smaller V5+ ions into smaller Zn2+ host lattice sites. The fabricated FSJ devices displayed an asymmetric hysteresis behavior attributed to the ferroelectric polarization-dependent Schottky field-emission rate difference in between positive and negative bias voltage regions. Additionally, it was observed that the magnitude of the on-state current could be systematically controlled by changing either the amplitude or the width of the applied voltage pulses. Owing to these voltage pulse-tunable multi-state memory characteristics, the device revealed diverse synaptic functions such as short-term memory, dynamic range-tunable long-term memory, and versatile rules in spike time-dependent synaptic plasticity. For the pattern-recognition simulation, furthermore, more than 95% accuracy was recorded when using the optimized experimental device parameters. These findings suggest the ZnVO-based FSJ device holds significant promise for application in next-generation brain-inspired neuromorphic computing systems. Full article
(This article belongs to the Section Nanoelectronics, Nanosensors and Devices)
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17 pages, 2681 KiB  
Article
Anodizing Tungsten Foil with Ionic Liquids for Enhanced Photoelectrochemical Applications
by Elianny Da Silva, Ginebra Sánchez-García, Alberto Pérez-Calvo, Ramón M. Fernández-Domene, Benjamin Solsona and Rita Sánchez-Tovar
Materials 2024, 17(6), 1243; https://doi.org/10.3390/ma17061243 - 8 Mar 2024
Cited by 4 | Viewed by 1474
Abstract
This research examines the influence of adding a commercial ionic liquid to the electrolyte during the electrochemical anodization of tungsten for the fabrication of WO3 nanostructures for photoelectrochemical applications. An aqueous electrolyte composed of 1.5 M methanesulfonic acid and 5% v/ [...] Read more.
This research examines the influence of adding a commercial ionic liquid to the electrolyte during the electrochemical anodization of tungsten for the fabrication of WO3 nanostructures for photoelectrochemical applications. An aqueous electrolyte composed of 1.5 M methanesulfonic acid and 5% v/v [BMIM][BF4] or [EMIM][BF4] was used. A nanostructure synthesized in an ionic-liquid-free electrolyte was taken as a reference. Morphological and structural studies of the nanostructures were performed via field emission scanning electron microscopy and X-ray diffraction analyses. Electrochemical characterization was carried out using electrochemical impedance spectroscopy and a Mott–Schottky analysis. From the results, it is highlighted that, by adding either of the two ionic liquids to the electrolyte, well-defined WO3 nanoplates with improved morphological, structural, and electrochemical properties are obtained compared to samples synthesized without ionic liquid. In order to evaluate their photoelectrocatalytic performance, the samples were used as photocatalysts to generate hydrogen by splitting water molecules and in the photoelectrochemical degradation of methyl red dye. In both applications, the nanostructures synthesized with the addition of either of the ionic liquids showed a better performance. These findings confirm the suitability of ionic liquids, such as [BMIM][BF4] and [EMIM][BF4], for the synthesis of highly efficient photoelectrocatalysts via electrochemical anodization. Full article
(This article belongs to the Special Issue Novel Nanomaterials for Energy Storage and Catalysis)
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