Engineering Multidisciplinary Editorial Board Meeting Held in Singapore on 19 May 2025

MDPI Singapore successfully hosted its first in-person Engineering Multidisciplinary Editorial Board Meeting on 19 May 2025.

We are deeply thankful for the enthusiastic participation and strong support of our Editorial Board Members (EBMs). It was a valuable opportunity to connect face-to-face and discuss the future development of the engineering subject area. We would like to invite everyone to jointly review the content of this meeting, and we look forward to welcoming even more EBMs to our future gatherings.

The meeting kicked off with a light icebreaker, where participants introduced themselves and shared their academic backgrounds and experience with MDPI. This was followed by a brief overview of MDPI’s presence in the engineering field—showcasing our journals, performance statistics, and outreach activities.

Discussions then focused on ways to grow and enhance MDPI’s engineering portfolio. Topics included the following:

Strategies to attract high-quality submissions.
Improving journals’ visibility.
Enhancing author support and increasing submission success rates.
Strengthening the role and engagement of EBMs.
Identifying emerging research topics.

We wrapped up with an open sharing session, where EBMs reflected on their experiences working with MDPI and offered thoughtful suggestions for improvement. Their ideas were insightful and sparked some great conversations.

We are truly grateful to all attendees for their time, ideas, and commitment. Collaborating with such passionate scholars is an honor, and we look forward to working closely together to elevate research excellence in the engineering field.

Journals our EBMs are affiliated with:

Applied Sciences;
Aerospace;
Bioengineering;
JMMP.