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Special Issue "Smart Systems"
Deadline for manuscript submissions: closed (20 July 2018).
Prof. Dr. Hidemitsu Furukawa Website E-Mail
1. Chair of Life-3D Printing Innovation Center (LPIC), Yamagata University, Japan
2. PI of Soft & Wet Matter Engineering Laboratory (SWEL), Department of Mechanical Systems Engineering, Graduate School of Science and Engineering, Yamagata University, 4-3-16 Jonan, Yonezawa City, Yamagata, 992-8510 Japan
Interests: gels; 3D Printing; light scattering; soft matter; shape memory
Dr. Ajit Khosla Website E-Mail
Department of Mechanical Systems Engineering, Graduate School of Science and Engineering, Yamagata University, Japan
Interests: MEMS/NEMS; wearable sensors, precision medicine; flexible sensors; MEMS/NEMS; wearable devices; 3D printed sensors and systems; healthcare; 4D materials; IoT
We are planning to publish a Special Issue on "Smart System" for the International Conference of Smart Systems Engineering (SmaSys2017, http://smasys.yz.yamagata-u.ac.jp/2017/) which was held on October 12–13, 2017, in Yonezawa, Japan. The issue “Smart System” provides opportunities for collaboration across a wide range of fields and technologies related to emerging smart systems. The smart system covers broad scientific and engineering fields. It consists of organic materials, biomaterials, electrical engineering, mechanical systems, green materials, tour engineering, engineering education, etc.
All the participants of SmaSys2017 and their colleagues, especially the students, are encouraged to submit to this Special Issue.
Prof. Dr. Hidemitsu Furukawa
Prof. Dr. Bungo Ochiai
Dr. Ajit Khosla
Dr. Masato Makino
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Technologies is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- organic materials, organic electronics and organic device
- biomaterials, biomedical and biosystems engineering
- electrical engineering and informatics
- mechanical systems engineering
- smart flexible structures and systems
- green materials and processing
- tourism engineering with agriculture and foods
- new engineering education