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Smart Systems

This special issue belongs to the section “Innovations in Materials Science and Materials Processing“.

Special Issue Information

Dear Colleagues,

We are planning to publish a Special Issue on "Smart System" for the International Conference of Smart Systems Engineering (SmaSys2017, http://smasys.yz.yamagata-u.ac.jp/2017/) which was held on October 12–13, 2017, in Yonezawa, Japan. The issue “Smart System” provides opportunities for collaboration across a wide range of fields and technologies related to emerging smart systems. The smart system covers broad scientific and engineering fields. It consists of organic materials, biomaterials, electrical engineering, mechanical systems, green materials, tour engineering, engineering education, etc.

All the participants of SmaSys2017 and their colleagues, especially the students, are encouraged to submit to this Special Issue.

Prof. Dr. Hidemitsu Furukawa
Prof. Dr. Bungo Ochiai
Dr. Ajit Khosla
Dr. Masato Makino
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Technologies is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • organic materials, organic electronics and organic device
  • biomaterials, biomedical and biosystems engineering
  • electrical engineering and informatics
  • mechanical systems engineering
  • smart flexible structures and systems
  • green materials and processing
  • tourism engineering with agriculture and foods
  • new engineering education

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Technologies - ISSN 2227-7080
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