Special Issue "Smart Systems (SmaSys2018)"

A special issue of Technologies (ISSN 2227-7080). This special issue belongs to the section "Innovations in Materials Processing".

Deadline for manuscript submissions: 1 June 2019

Special Issue Editors

Guest Editor
Prof. Dr. Hidemitsu Furukawa

1. Chair of Life-3D Printing Innovation Center (LPIC), Yamagata University, Japan
2. PI of Soft & Wet Matter Engineering Laboratory (SWEL), Department of Mechanical Systems Engineering, Graduate School of Science and Engineering, Yamagata University, 4-3-16 Jonan, Yonezawa City, Yamagata, 992-8510 Japan
Website | E-Mail
Phone: +81-(0)238-26-3197
Interests: gels; 3D Printing; light scattering; soft matter; shape memory
Guest Editor
Prof. Dr. Bungo Ochiai

Department of Chemistry and Chemical Engineering, Graduate School of Science and Engineering, Yamagata University, Japan
Website | E-Mail
Interests: polymer chemistry; organic–inorganic hybrid material; green chemistry
Guest Editor
Dr. Masato Makino

Department of Mechanical Systems Engineering, Graduate School of Science and Engineering, Yamagata University, Japan
Website | E-Mail
Interests: microhydrodynamics; soft matter physics; 3D printing
Guest Editor
Dr. Ajit Khosla

Department of Mechanical Systems Engineering, Graduate School of Science and Engineering, Yamagata University, Japan
Website | E-Mail
Interests: MEMS/NEMS; wearable sensors, precision medicine; flexible sensors; MEMS/NEMS; wearable devices; 3D printed sensors and systems; healthcare; 4D materials; IoT

Special Issue Information

Dear Colleagues,

We are planning to publish a Special Issue on "Smart System" related to the International Conference of Smart Systems Engineering (SmaSys2018, http://smasys.yz.yamagata-u.ac.jp/2018/) which was held on 11–12 October 2018, in Yonezawa, Japan. The Special Issue “Smart System” provides opportunities for collaboration across a wide range of fields and technologies related to emerging smart systems. Smart systems regard broad scientific and engineering fields. They include organic materials, organic electronics, organic devices, biomaterials, biomedical and biosystem engineering, electrical engineering and informatics, mechanical systems engineering, smart flexible structure and systems, green materials and their processing, tourism engineering with agriculture and foods, and new engineering education.

All the participants of SmaSys2018 and their colleagues, especially the students, are encouraged to submit their works to this Special Issue.

Prof. Dr. Hidemitsu Furukawa
Prof. Dr. Bungo Ochiai
Dr. Masato Makino
Dr. Ajit Khosla
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Technologies is an international peer-reviewed open access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 350 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • organic materials, organic electronics, and organic devices
  • biomaterials, biomedical, and biosystems engineering
  • electrical engineering and informatics
  • mechanical systems engineering
  • smart flexible structures and systems
  • green materials and processing
  • tourism engineering with agriculture and foods
  • new engineering education

Published Papers

This special issue is now open for submission.
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