Editorial Board
Please note that the order in which the Editors appear on this page is alphabetical, and follows the structure of the editorial board presented on the MDPI website under information for editors: editorial board responsibilities.
Members
Department of Electrical Engineering, City University of Hong Kong, Hong Kong SAR, China
Interests: CMOS integrated circuits; high-k dielectric thin films; nanoelectronics; semiconductor device models; MOSFET; approximation theory; ballistic transport; circuit optimisation; electrostatics; elemental semiconductors; field effect transistors; nanowires; numerical analysis; sensitivity; silicon; surface potential; surface roughness; silicon compounds; dielectric thin films; tunnelling; interface states; X-ray photoelectron spectra; electron traps; hafnium compounds; SPICE
Special Issues, Collections and Topics in MDPI journals
Interests: CMOS integrated circuits; high-k dielectric thin films; nanoelectronics; semiconductor device models; MOSFET; approximation theory; ballistic transport; circuit optimisation; electrostatics; elemental semiconductors; field effect transistors; nanowires; numerical analysis; sensitivity; silicon; surface potential; surface roughness; silicon compounds; dielectric thin films; tunnelling; interface states; X-ray photoelectron spectra; electron traps; hafnium compounds; SPICE
Special Issues, Collections and Topics in MDPI journals
School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen 518172, China
Interests: semiconductor materials and devices; quantum dot nanomaterials; micro-LED display technology
Interests: semiconductor materials and devices; quantum dot nanomaterials; micro-LED display technology
State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China
Interests: optical nanometrology; ellipsometry and polarimetry; scatterometry
Special Issues, Collections and Topics in MDPI journals
Interests: optical nanometrology; ellipsometry and polarimetry; scatterometry
Special Issues, Collections and Topics in MDPI journals
Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan
Interests: CMOS-MEMS; microsensors; microactuators
Special Issues, Collections and Topics in MDPI journals
Interests: CMOS-MEMS; microsensors; microactuators
Special Issues, Collections and Topics in MDPI journals
Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON L8S 4K1, Canada
Interests: micro-/nano-/opto-electronics; nanotechnology and data analytics for health and environmental applications; bioimagers; biosensors
Special Issues, Collections and Topics in MDPI journals
Interests: micro-/nano-/opto-electronics; nanotechnology and data analytics for health and environmental applications; bioimagers; biosensors
Special Issues, Collections and Topics in MDPI journals
Electrical and Computer Engineering, Pennsylvania State University at Erie, Erie, PA 16563, USA
Interests: machine learning; organic electronics; renewable energy
Special Issues, Collections and Topics in MDPI journals
Interests: machine learning; organic electronics; renewable energy
Special Issues, Collections and Topics in MDPI journals
1. College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan
2. Semiconductor Research Center, Hon Hai Research Institute, Taipei, Taiwan
Interests: micro-LEDs; semiconductor lasers; VCSELs; metasurface; GaN HEMT
Special Issues, Collections and Topics in MDPI journals
2. Semiconductor Research Center, Hon Hai Research Institute, Taipei, Taiwan
Interests: micro-LEDs; semiconductor lasers; VCSELs; metasurface; GaN HEMT
Special Issues, Collections and Topics in MDPI journals
Department of Advanced Manufacturing and Robotics, College of Engineering, Peking University, Beijing 100871, China
Interests: wide-bandgap semiconductor; sensors; nanoelectronics; artificial intelligence
Special Issues, Collections and Topics in MDPI journals
Interests: wide-bandgap semiconductor; sensors; nanoelectronics; artificial intelligence
Special Issues, Collections and Topics in MDPI journals
Laboratory of Nano Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
Interests: optical communication; microwave photonics; lasers for information and modular integration technology
Special Issues, Collections and Topics in MDPI journals
Interests: optical communication; microwave photonics; lasers for information and modular integration technology
Special Issues, Collections and Topics in MDPI journals
Research and Development Center for Solid State Lighting, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
Interests: wide-band gap semiconductor materials and devices; nitride light-emitting devices; novel nitride optoelectronic devices; nanostructured materials and devices
Interests: wide-band gap semiconductor materials and devices; nitride light-emitting devices; novel nitride optoelectronic devices; nanostructured materials and devices
Department of Electrical Engineering (SEL), São Carlos School of Engineering (EESC), University of São Paulo (USP), São Carlos 13566-590, Brazil
Interests: analog and digital integrated circuits; micromachining and micro/nanofabrication technologies for mixed-mode/RF systems; solid-state integrated sensors; microactuators and microsystems; micro/nanodevices for industrial and biomedical applications; wireless systems for sensors and actuators; optical sensors and actuators; material technology for microsystems; microprocessor/microcomputer-based instrumentation and data-acquisition systems
Special Issues, Collections and Topics in MDPI journals
Interests: analog and digital integrated circuits; micromachining and micro/nanofabrication technologies for mixed-mode/RF systems; solid-state integrated sensors; microactuators and microsystems; micro/nanodevices for industrial and biomedical applications; wireless systems for sensors and actuators; optical sensors and actuators; material technology for microsystems; microprocessor/microcomputer-based instrumentation and data-acquisition systems
Special Issues, Collections and Topics in MDPI journals
Dipartimento di Ingegneria Elettrica Elettronica e Informatica (DIEEI), Università di Catania, 95125 Catania, Italy
Interests: radio frequency (RF) and millimeter wave (mm-wave) integrated circuits/systems for wireless communication systems
Special Issues, Collections and Topics in MDPI journals
Interests: radio frequency (RF) and millimeter wave (mm-wave) integrated circuits/systems for wireless communication systems
Special Issues, Collections and Topics in MDPI journals
Department of Electrical Engineering, The City College of New York, New York, NY 10031, USA
Interests: compound semiconductors; wide gap semiconductors; magnetic semiconductors; molecular beam epitaxy; photonic devices; intersubband devices; IR detectors; UV detectors
Interests: compound semiconductors; wide gap semiconductors; magnetic semiconductors; molecular beam epitaxy; photonic devices; intersubband devices; IR detectors; UV detectors
School of Mechanical Engineering, Dalian University of Technology, Dalian 116024, China
Interests: synthesis and characterization of nanostructured materials; mechanical, electrical, piezoelectrical, photoelectrical properties study of nanomaterials; fabrication of piezoelectrical nanogenerators, energy cell, photoelectric nanosensors and other nanodevices
Interests: synthesis and characterization of nanostructured materials; mechanical, electrical, piezoelectrical, photoelectrical properties study of nanomaterials; fabrication of piezoelectrical nanogenerators, energy cell, photoelectric nanosensors and other nanodevices
Institute for Microelectronics, Vienna University of Technology, 1040 Vienna, Austria
Interests: digital spintronics; spin-transfer torque devices; spin-orbit torque devices; in-memory computing
Special Issues, Collections and Topics in MDPI journals
Interests: digital spintronics; spin-transfer torque devices; spin-orbit torque devices; in-memory computing
Special Issues, Collections and Topics in MDPI journals
School of Electro-Mechanical Engineering, Xidian University, Xi’an 710000, China
Interests: MEMS technology; electronic packaging and microassembly technology
Special Issues, Collections and Topics in MDPI journals
Interests: MEMS technology; electronic packaging and microassembly technology
Special Issues, Collections and Topics in MDPI journals
Department of Engineering and Applied Sciences, University of Bergamo, Via Marconi 5, 24044 Dalmine, Italy
Interests: low-noise front-end electronics; radiation effects in CMOS technology; CMOS active pixel sensors; voltage references and regulators; wearable monitoring systems
Special Issues, Collections and Topics in MDPI journals
Interests: low-noise front-end electronics; radiation effects in CMOS technology; CMOS active pixel sensors; voltage references and regulators; wearable monitoring systems
Special Issues, Collections and Topics in MDPI journals
School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, China
Interests: advanced packaging; multiphysics modeling and simulation; reliability analysis
Special Issues, Collections and Topics in MDPI journals
Interests: advanced packaging; multiphysics modeling and simulation; reliability analysis
Special Issues, Collections and Topics in MDPI journals
School of Physics, Peking University, Beijing 100871, China
Interests: wide-bandgap semiconductors; nitride ferroelectrics
Special Issues, Collections and Topics in MDPI journals
Interests: wide-bandgap semiconductors; nitride ferroelectrics
Special Issues, Collections and Topics in MDPI journals
School of Microelectronics, Hefei University of Technology, Hefei 230601, China
Interests: fault tolerance; radiation hardening; soft error; design for reliability; circuit aging; non-volatile memory; SRAM; TSV; machine learning
Interests: fault tolerance; radiation hardening; soft error; design for reliability; circuit aging; non-volatile memory; SRAM; TSV; machine learning
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong 999077, China
Interests: optical wireless physical layer circuits and systems; millimeter-wave communication and sensing circuits; high-speed wireline communication system-on-chip (SoC); edge computing accelerator design for IoT applications; indoor positioning and image processing technologies for robotic applications
Interests: optical wireless physical layer circuits and systems; millimeter-wave communication and sensing circuits; high-speed wireline communication system-on-chip (SoC); edge computing accelerator design for IoT applications; indoor positioning and image processing technologies for robotic applications
1. MEMS Center, Harbin Institute of Technology, Harbin 150001, China
2. Key Laboratory of Micro-Systems and Micro-Structures Manufacturing, Ministry of Education, Harbin 150001, China
Interests: MEMS technology; integrated sensor; artificial intelligence and micro-nano integrated devices and systems
Special Issues, Collections and Topics in MDPI journals
2. Key Laboratory of Micro-Systems and Micro-Structures Manufacturing, Ministry of Education, Harbin 150001, China
Interests: MEMS technology; integrated sensor; artificial intelligence and micro-nano integrated devices and systems
Special Issues, Collections and Topics in MDPI journals
School of Electronic and Computer Engineering, Peking University, Beijing, China
Interests: semiconductor device physics; compact modeling; circuit simulation algorithm; neuromorphic computing
Interests: semiconductor device physics; compact modeling; circuit simulation algorithm; neuromorphic computing
Institute of Modern Optics, Tianjin Key Laboratory of Micro-Scale Optical Information Science and Technology, Nankai University, Tianjin 300071, China
Interests: silicon photonics and optical neural networks; wide bandgap semiconductors; intelligent light-emitting material devices
Interests: silicon photonics and optical neural networks; wide bandgap semiconductors; intelligent light-emitting material devices
The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China
Interests: surface; interface, and defects in semiconductors and insulators; co-design; advanced packaging; wide bandgap materials; phase change materials; transparent conduction materials; novel 2D materials; energy conversion and storage; single-atom catalysts; heterojunction photocatalysis
Interests: surface; interface, and defects in semiconductors and insulators; co-design; advanced packaging; wide bandgap materials; phase change materials; transparent conduction materials; novel 2D materials; energy conversion and storage; single-atom catalysts; heterojunction photocatalysis
Ningbo Institute of Industrial Technology, Chinese Academy of Sciences, Ningbo, China
Interests: brain-inspired neuromorphic engineering; brain-inspired neuromorphic devices; memristor; optoelectronic computing; optoelectronic semiconductor materials and devices
Interests: brain-inspired neuromorphic engineering; brain-inspired neuromorphic devices; memristor; optoelectronic computing; optoelectronic semiconductor materials and devices
