Sensing and Imaging for Defect Detection
Deadline for manuscript submissions: 30 June 2024 | Viewed by 6520
Interests: NDT&E technology with ultrasonic, electromagnetic; imaging processing technology; high-imaging-resolution technology
Interests: sensor technology; structural health monitoring technology
With the progress made in science and technology, the quality of people's material and cultural lives has improved, meaning that the requirements for product quality and nondestructive testing technology have further increased. Nondestructive testing technology usually includes five conventional testing technologies, namely eddy current, penetration, magnetic particle, ultrasonic, and X-ray, along with their related new technologies. Usually, different materials need to be detected, and the defects that need to be detected are not the same—for example, for metals, defects include non-metallic pipe defects and slag inclusions, the metal not being welded through, porosity, etc.; for the power transmission of porcelain bottles such as ceramic materials, defects include cracks, porosity, etc.
This Special Issue calls for papers aimed at the detection of the most common defects, including surface defects, subsurface defects and so on. Recent advances in sensor technologies form the basis of the development of nondestructive testing technology, data acquirement processing, and image processing technology.
The editors welcome the submission of high-quality research papers not previously published in other journals as well as review articles discussing recent advancements in the development of sensing and imaging techniques for defect detection technology that can be easily used in the NDT&E field.
Prof. Dr. Haitao Wang
Dr. Yongkai Zhu
Dr. Fei Fei
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- sensors NDT&E technology
- defect detection technology
- imaging technology
- data acquirement and processing
- sensing techniques