Special Issue "Selected Papers from TENCON 2018"
Deadline for manuscript submissions: closed (28 February 2019) | Viewed by 6707
Interests: sensor; MEMS
Interests: passive/active neural probe design and fabrication for bio-medical applications; high speed memory design; architecture and process technology; new emerging memory development; product planning of memory; electronic components and connectivity modules
Interests: quantum and optical electronics
TENCON is a premier conference of IEEE Region 10. IEEE TENCON 2018 will be held at Jeju Island, Korea, from 28–31 October, 2018 (http://tencon2018.org/). Traditionally, TENCONs have encompassed all areas in electrical and electronics engineering, as well as information technologies. Recently, advances in sensor technologies have had a remarkable influence on TENCON; sensors and their applications now stand out as notable topics in every area of TENCON, which includes materials, devices, communications, signal processing, and computing. While following the tradition of previous TENCONs, TENCON 2018 will provide a place to deeply discuss the infrastructure that leads to “smartness everywhere”. In such a place, we expect that highly valuable research works will be presented on sensors, sensor networks, and their applications.
This Special Issue selects excellent papers from IEEE TENCON 2018 and covers sensors, sensor networks and their applications, e.g., IoT. Authors of outstanding papers at TENCON 2018, which are related to sensors, sensor networks and their applications, will be invited to submit extended versions of their works to this Special Issue for publication.
Potential topics include, but are not limited to
- IoT based smart cities
- Ad hoc sensor networks
- Energy harvesting sensor networks
- Sensor device structure
- Advanced sensor materials
Prof. Dr. Kukjin Chun
Prof. Dr. Changhyun Kim
Prof. Dr. Jong Chang Yi
Prof. Dr. Cheon Won Choi
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.