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Emerging Wireless Propagation: Antenna Arrays and Microwave Sensing Technologies

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Communications".

Deadline for manuscript submissions: 15 April 2026 | Viewed by 3

Special Issue Editors

School of Electronics and Information Engineering, Harbin Institute of Technology, Harbin 150001, China
Interests: microwave; millimeter wave circuit; metamaterial; FSS; numerical solution of electromagnetic field; electromagnetic compatibility
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Guest Editor
School of Electronic and Information Engineering, Nanjing University of Information Science and Technology, Nanjing, China
Interests: analysis and modeling of the radar cross-section reduction system using frequency-selective surface; electromagnetically induced transparency; absorptive material; rasorber; adaptive arrays, metamaterial antennas; metamaterial structures
Special Issues, Collections and Topics in MDPI journals
School of Information and Communication Engineering, Harbin Engineering University, Harbin 150001, China
Interests: leaky-wave antenna; FSS; metamaterial

Special Issue Information

Dear Colleagues,

The rapid evolution of wireless communication technologies demands advanced solutions in propagation systems, antenna design, and microwave devices. This Special Issue focuses on cutting-edge research on next-generation wireless systems, including smart antennas, massive MIMO, metamaterial-based devices, and antenna, phased, and reconfigurable arrays. We invite contributions addressing theoretical innovations, experimental validations, and practical applications to overcome challenges in 5G/6G, IoT, and beyond.

Dr. Jiahui Fu
Dr. Zhefei Wang
Dr. Wan Chen
Guest Editors

Manuscript Submission Information

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Keywords

  • antenna arrays
  • microwave devices
  • biomedical RF sensors
  • MIMO systems
  • metamaterials
  • metasurface
  • beamforming
  • reconfigurable antennas
  • 5G/6G technologies
  • IoT connectivity
  • mm wave communications

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Published Papers

This special issue is now open for submission.
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