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Special Issue "Integrated Sensors Based on Silicon-on-Insulator (SOI)"

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Sensor Networks".

Deadline for manuscript submissions: 31 December 2020.

Special Issue Editors

Prof. Dr. Denis Flandre
Website
Guest Editor
Universite Catholique de Louvain, Louvain-la-Neuve, Belgium
Interests: SOI MOS Devices; Digital and Analog Circuits, as well as Sensors; MEMS and Solar Cells; Ultra Low-voltage Low-power; Microwave; Biomedical; Radiation-hardened and High-Temperature Electronics and Microsystems
Special Issues and Collections in MDPI journals
Dr. Nicolas Andre
Website
Guest Editor
Universite Catholique de Louvain, Louvain-la-Neuve, Belgium
Interests: MEMS; Microsystems; Gas Sensor; Biomimetism; Monolithic Integration

Special Issue Information

Dear Colleagues,

The need for miniaturized sensors and MEMS becomes ever more pressing considering the emergence of Internet of Things (IoT) applications, autonomous cars, structural health monitoring, smart maintenance and logistics in Industry 4.0, point-of-care medicine, smart cities, etc. Over the years, Silicon-on-Insulator (SOI) has proven to be a very adequate technology for the integration of high-performance sensors and MEMS, as well as of their analog and digital interfaces. The benefits of specific SOI features have been exploited, such as ultra-low-power, high-temperature reliability, radiation hardness, to name but a few. SOI research and industrial platforms have further enabled CMOS compatibility with novel materials and structures for sensing applications beyond traditional MEMS micromachining processes. Research and commercial developments have addressed numerous physical and chemical sensing capabilities on SOI substrates, including temperature, light (from UV to IR), magnetic, flow, pressure, stress, gas, biomolecules, and physiological parameters.

The present Special Issue seeks to regroup and publish innovative works exploring novel solutions, concepts, and implementations of integrated sensors based on SOI technology, at any level from their fabrication to their design, simulation, measurement, modeling, optimization, circuit interface, signal processing, networking, or applications. Comparisons of integrated vs. hybrid or micro- vs nanorealizations are welcome, most notably in terms of multipurpose platforms, performance levels (sensitivity, signal/noise, power consumption, cost issues, etc.).

Prof. Denis Flandre
Dr. Nicolas Andre
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

Particular areas of interest include, but are not limited to:
  • IoT, 5G Platforms
  • Health, Medicine
  • Automotive, Aeronautics, Space
  • Smart Monitoring, Energy Harvesting
  • Implantable, On-Body or Flexible Electronics, Wearables

Published Papers

This special issue is now open for submission.
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