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Epoxy Resin and Composites: Properties and Applications

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Composites and Nanocomposites".

Deadline for manuscript submissions: 25 September 2025 | Viewed by 1685

Special Issue Editor


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Guest Editor
Department of Chemical and Materials Engineering, National Chin-Yi University of Technology, Taichung 41170, Taiwan
Interests: resin-based materials; optoelectronic materials; nanocomposites; electronic packaging materials; carbon footprint; life cycle assessment
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Epoxy is a widely used, synthesized resin for general purposes and industrial applications. Epoxy composites with new components and structures are developed with attractive properties, mainstreaming, sustainability and exciting potential applications are emerging.

This Special Issue focuses on the synthesis, characterization, addition of other materials to enhance performance, simulation and derivation of performance, optimization, life cycle assessment, environmental friendliness, etc.

In light of this, we are organizing a Special Issue focused on high-quality original research papers or comprehensive reviews on cutting-edge developments in the field of resin-based polymer materials. Potential topics include, but are not limited to, the following:

  • epoxy resin;
  • epoxy composites;
  • enhance performance of resin;
  • resin performance optimization;
  • calculation and simulation of resin chemistry;
  • life cycle assessment of resin;
  • and carbon reduction.

Prof. Dr. Huey Ling Chang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • epoxy composite
  • enhance performance of resin
  • resin performance optimization
  • calculation and simulation of resin chemistry

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Published Papers (1 paper)

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Research

37 pages, 8597 KiB  
Article
Evaluation and Characterization of Functionally Graded Adhesive Joints: Experimental and Numerical Analyses
by Yanan Zhang, Pedro Gálvez, Miguel Angel Martínez, Juana Abenojar and Magd Abdel Wahab
Polymers 2024, 16(24), 3561; https://doi.org/10.3390/polym16243561 - 20 Dec 2024
Viewed by 1034
Abstract
Epoxy resins have exhibited exceptional performance in engineering applications, particularly as a replacement for traditional mechanical joints in adhesive bonding. This study evaluates the suitability of two innovative adhesives, SikaPower®-1511 and SikaPower®-1548, in various graded configurations. The thermal curing [...] Read more.
Epoxy resins have exhibited exceptional performance in engineering applications, particularly as a replacement for traditional mechanical joints in adhesive bonding. This study evaluates the suitability of two innovative adhesives, SikaPower®-1511 and SikaPower®-1548, in various graded configurations. The thermal curing behavior of the adhesives was analyzed using differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy (FTIR). Shear tests and finite element simulations were employed to investigate the strength performance and interfacial stress distribution of four adhesive configurations, including single and graded joints in single lap adhesive joints. The results show that SikaPower®-1548 reveals a slower heat-curing rate and achieves an average shear limit load of 9 MPa, outperforming the more rigid SikaPower®-1511, which reaches 4 MPa. Ultimate load predictions indicate that the shear strength of the 1511-1548-1511 graded configuration is slightly lower than that of SikaPower®-1511, with a decrease of 8.86%. In contrast, the 1548-1511-1548 configuration demonstrates a significant improvement, achieving a 32.20% increase in shear strength, along with a 13.12% reduction in peel stress field intensity at the interface end and a 12.21% reduction in shear stress field intensity. Overall, the experimental and simulation results highlight the significant advantages of graded joints over traditional single joints in alleviating stress concentrations and enhancing joint strength. Additionally, the research confirms the potential of epoxy resins in advanced engineering applications, providing a reliable theoretical foundation and technical guidance for the design of graded adhesives. Full article
(This article belongs to the Special Issue Epoxy Resin and Composites: Properties and Applications)
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