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Advances in Polymer-Based Electronic Materials

A Special Issue of Polymers (ISSN 2073-4360) belonging to the section "Polymer Applications".

Deadline for manuscript submissions: 31 December 2026 | Viewed by 2472

Editor


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Guest Editor
College of Chemistry and Chemical Engineering, Central South University, Changsha 410083, China
Interests: piezoelectric fiber composites; piezoelectric polymers; flexible piezoelectric device; modification of epoxy resin; piezoelectric sensor; piezoelectric actuator
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Special Issue Information

Dear Colleagues,

Polymer-based electronic materials have been widely studied and applied in flexible electronics, energy storage systems, and wearable sensing devices, owing to their versatile properties and feasible manufacturing processes. In recent years, the research community has expressed considerable interest in developing novel approaches to modify and functionalize polymer-based electronic materials, as well as engineering innovative structures and capabilities for associated devices.

This Special Issue on “Advances in Polymer-Based Electronic Materials” is dedicated to the most recent research regarding the design, preparation, and performance of polymer-based electronic materials encompassing dielectric polymer, piezoelectric polymers, ferroelectric polymers, polymer electronic composites, and polymer-derived electronic films. Moreover, investigations on the fabrication techniques and practical application scenarios of flexible and high-performance polymer-based electronic devices will be included.

Dr. Xi Yuan
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • dielectric polymers
  • piezoelectric polymers
  • ferroelectric polymers
  • thermoelectric polymers
  • conducting polymers
  • semiconductor polymers
  • polymer electronic composites
  • flexible electronic devices
  • wearable sensing devices

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Published Papers (1 paper)

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Research

21 pages, 11335 KB  
Article
Enhanced Mechanical and Thermal Properties of Epoxy Resins Through Hard–Soft Biphasic Synergistic Toughening with Modified POSS/Polysulfide Rubber
by Xi Yuan, Zhineng Tan, Shengwen Liu, Hang Luo, Zhuo Chen and Dou Zhang
Polymers 2026, 18(2), 184; https://doi.org/10.3390/polym18020184 - 9 Jan 2026
Cited by 2 | Viewed by 2039
Abstract
Toughening modification of epoxy resin (EP) matrices is important for advancing high-performance fiber-reinforced composites. A promising strategy involves the use of multi-component additive systems. However, synergistic effects in such additive systems are difficult to achieve for multidimensional performance optimization due to insufficient interfacial [...] Read more.
Toughening modification of epoxy resin (EP) matrices is important for advancing high-performance fiber-reinforced composites. A promising strategy involves the use of multi-component additive systems. However, synergistic effects in such additive systems are difficult to achieve for multidimensional performance optimization due to insufficient interfacial interactions and competing toughening mechanisms. Herein, a “hard–soft” biphasic synergistic toughening system was engineered for epoxy resin, composed of furan-ring-grafted polyhedral oligomeric silsesquioxane (FPOSS) and liquid polysulfide rubber. The hybrid toughening agent significantly enhanced the integrated performance of the epoxy system: Young’s modulus, tensile strength, and elongation at break increased by 13%, 56%, and 101%, respectively. These improvements are attributed to the formation of enriched molecular chain entanglement sites and optimized dispersion, facilitated by nucleophilic addition reactions between flexible rubber segments and rigid FPOSS units with the epoxy matrix. The marked enhancement in toughness primarily stems from the synergistic toughening mechanism involving “crazing pinning” and “crazing-shear band”. Concurrently, FPOSS incorporation effectively modulated the curing reaction kinetics, rendering the process more gradual while substantially elevating the glass transition temperature (Tg) of the cured system by 16.82 °C and endowing it with superior thermal degradation stability. This work provides a simple and unique strategy to leverage multi-scale mechanisms for the construction of epoxy-based composites with good toughness and strength, and enhanced heat resistance. Full article
(This article belongs to the Special Issue Advances in Polymer-Based Electronic Materials)
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