Advances in RF MEMS Devices

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E:Engineering and Technology".

Deadline for manuscript submissions: closed (28 February 2021) | Viewed by 7709

Special Issue Editor


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Guest Editor
School of Electrical Engineering and Telecommunications, University of New South Wales, Sydney, NSW 2052, Australia
Interests: microwave; millimetre-wave; Terahertz; RF MEMS; MEMS; microwave resonators; millimetre-wave resonators; Terahertz resonators; antennas; radars

Special Issue Information

Dear Colleagues,

Over the past 20 years, surface and bulk micromachining techniques have been utilized to improve the functionality performance of RF/microwave and millimeter-wave devices. More recently, they have enabled the application of these devices towards sub-millimeter frequency ranges. Radio frequency micro-electro-mechanical (RF MEMS) systems offer unique, low-cost, and exceptional RF performance, unmatched by their pure mechanical or silicon counterparts to many wireless applications. This Special Issue seeks original research presented as reviews and articles that showcase advances in RF MEMS devices, their applications, actuation mechanisms, and novel fabrication techniques. We are interested in RF MEMS technologies that enable distinct advantages in:

i. high-performance high-power tunable microwave filters;

ii. frequency-tunable and radiation pattern reconfigurable and steerable antennas;

iii. frequency-selective surfaces;

iv. impedance matching networks for extensive impedance coverage over wide frequency ranges;

v. phase shifters with small phase-shift values and broadband frequency coverage;

and vi. switching networks that offer low-loss ultra-wide bandwidth operation.

Dr. King Yuk Chan
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

DMTL; ECPW; MEMS switch; Bandpass filter (BPF); Evanescent-mode filter; High quality factor; MEMS-filter; Millimeter-wave filter; Reconfigurable filter; Tunable filter; BiCMOS integrated circuits; Charge pump circuits; Circuit tuning; Ge-Si alloys; Microswitches; S-parameters; Switching circuits; Cantilevers; Carbon nanotubes; Composite materials; Electroplating; Ohmic contact; CPW transmission line; MEMS technology; Micromachining; Metal and dielectric material deposition; MEMS structure release; Dielectric charging

Published Papers (2 papers)

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Research

14 pages, 3424 KiB  
Article
Periodic Analysis of Surface Acoustic Wave Resonator with Dimensionally Reduced PDE Model Using COMSOL Code
by Qiaozhen Zhang, Zhenglin Chen, Yanguang Chen, Jiahe Dong, Panliang Tang, Sulei Fu, Haodong Wu, Jinyi Ma and Xiangyong Zhao
Micromachines 2021, 12(2), 141; https://doi.org/10.3390/mi12020141 - 28 Jan 2021
Cited by 6 | Viewed by 4444
Abstract
Radio-frequency (RF) surface acoustic wave (SAW) resonators used as filters and duplexers are mass-produced and widely used in current mobile phones. With the numerous emergences of the diverse device structure, a universal method used for the accurate and fast simulation of the SAW [...] Read more.
Radio-frequency (RF) surface acoustic wave (SAW) resonators used as filters and duplexers are mass-produced and widely used in current mobile phones. With the numerous emergences of the diverse device structure, a universal method used for the accurate and fast simulation of the SAW resonator calls for urgent demand. However, there are too many instances where the behavior of the entire acoustic resonator cannot be characterized rapidly and efficiently due to limitations in the current computer memory and speed. This is especially true for SAW resonators configured with long arrays of inter-digital transducers (IDTs), and we have to resort to a periodic analysis. In this paper, the previously reported generalized partial differential equations (PDE) based on the two-dimensional finite element method (2D-FEM) model is extended to analysis for the periodic structure of the SAW resonator. We present model order reduction (MOR) techniques based on FEM and periodic boundary conditions to achieve a dimensionally reduced PDE model without decreasing the accuracy of computations. Examples of different SAW devices, including the regular SAW, IHP-SAW and TC-SAW resonators, are provided which shows the results of the periodic analysis compared with the experimental results of the actual resonators. The investigation results demonstrate the properties of the proposed methodology and prove its effectiveness and accuracy. Full article
(This article belongs to the Special Issue Advances in RF MEMS Devices)
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13 pages, 1997 KiB  
Article
Hybrid Full-Wave Analysis of Surface Acoustic Wave Devices for Accuracy and Fast Performance Prediction
by Zhenglin Chen, Qiaozhen Zhang, Sulei Fu, Xiaoyu Wang, Xiaojun Qiu and Haodong Wu
Micromachines 2021, 12(1), 5; https://doi.org/10.3390/mi12010005 - 22 Dec 2020
Cited by 9 | Viewed by 2805
Abstract
In this paper, a hybrid full-wave analysis of surface acoustic wave (SAW) devices is proposed to achieve accurate and fast simulation. The partial differential equation (PDE) models of the physical system in question and graphics processing unit (GPU)-assisted hierarchical cascading technology (HCT) are [...] Read more.
In this paper, a hybrid full-wave analysis of surface acoustic wave (SAW) devices is proposed to achieve accurate and fast simulation. The partial differential equation (PDE) models of the physical system in question and graphics processing unit (GPU)-assisted hierarchical cascading technology (HCT) are used to calculate acoustic-electric characteristics of a SAW filter. The practical solid model of the radio frequency (RF) filter package is constructed in High Frequency Structure Simulator (HFSS) software and the parasitic electromagnetics of the entire package is considered in the design process. The PDE-based models of the two-dimensional finite element method (2D-FEM) are derived in detail and solved by the PDE module embedded in COMSOL Multiphysics. Due to the advantages of PDE-based 2D-FEM, it is universal, efficient and not restricted to handling arbitrary materials and crystal cuts, electrode shapes, and multi-layered substrate. Combining COMSOL Multiphysics with a user-friendly interface, a flexible way of modeling and mesh generation, it can greatly reduce the complicated process of modeling and physical properties definition. Based on a hybrid full-wave analysis, we present an example application of this approach on a TC-SAW ladder filter with 5° YX-cut LiNbO3 substrate. Numerical results and measurements were calculated for comparison, and the accuracy and efficiency of the proposed method were verified. Full article
(This article belongs to the Special Issue Advances in RF MEMS Devices)
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